Bottom overturning heat dissipation mounting bracket for LED chip module

Abstract

The invention relates to the technical field of LED heat dissipation modules, in particular to a bottom overturning heat dissipation mounting bracket for an LED chip module. The bottom overturning heat dissipation mounting bracket for the LED chip module comprises a left metal fixed frame, a right metal fixed frame, and a plastic substrate plastically molded with the left and right metal fixed frames; and a main mounting groove for mounting LED chips is formed in the center position of the upper surface of the plastic substrate. The bottom overturning heat dissipation mounting bracket for theLED chip module is provided with X-shaped structure copper bottom heat dissipation brackets, with heat dissipation support plates, bottom heat dissipation plates and overturning connection side plates, fixedly clamped on connecting plates at the lower ends of the left and right metal fixed frames, so that the heat dissipation performance of the LED chip module is greatly improved; and the heat dissipation modes are various to adapt to multiple heat dissipation devices to achieve wider application range.

Description

technical field [0001] The invention relates to the technical field of LED heat dissipation components, in particular to a bottom-mounted flip-type heat dissipation mounting bracket for LED chip components. Background technique [0002] LED is the abbreviation of English light emitting diode (light emitting diode). It is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. Encapsulate the entire chip with epoxy resin. Its main function is to convert electrical energy into light energy, and the main material of the chip is monocrystalline silicon. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the problems existing in the above-mentioned background technology, an improved bottom-mounted flip-type heat dissipation mounting bracket for LED chip components is provided to solve the problem that the current plastic substrate has a simple structure and a single heat dissipation method. It is also impossible to install the matching cooling device, which leads to the problem of relatively limited cooling performance.

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