Packaging cover plate, display panel and display device

A technology for encapsulating cover plates and display substrates, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of electrode disconnection, virtual connection, and easy cracking, and achieve the effect of preventing lateral light leakage

Pending Publication Date: 2021-10-26
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a packaging cover, and also provides a display panel and a display device including the packaging cover, so as to solve the problem in the prior art that the auxiliary electrode and the backplane electrode are easily contacted due to pressure. Too large and easy to produce brittle cracks, resulting in technical problems of electrode disconnection or virtual connection

Method used

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  • Packaging cover plate, display panel and display device
  • Packaging cover plate, display panel and display device
  • Packaging cover plate, display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Such as Figure 2-4 As shown, the packaging cover plate 10 provided in this embodiment includes a cover plate 11, a black matrix 12 and a color filter layer 13 formed on the cover plate 11, and a flat surface covering the black matrix 12 and the color filter layer 13. layer 14, and the first auxiliary electrode unit 17 disposed on the flat layer 14, the color filter layer 13 includes a red color filter, a green color filter and a blue color filter, and the black matrix 12 and the color filter layer 13 are arranged at intervals. Wherein, the first auxiliary electrode unit 17 includes a light guide column 171 and a first auxiliary electrode 172, the light guide column 171 is formed on the side of the flat layer 14 away from the cover plate 11 and corresponds to the position of the color filter layer 13, That is, the orthographic projection of the light guide column 171 and the color filter layer 13 on the cover plate 11 overlaps, and the width of the light guide column 17...

Embodiment 2

[0076] Such as Figure 10-12 As shown, the packaging cover plate 10 provided in this embodiment includes a cover plate 11, a black matrix 12 and a color filter layer 13 formed on the cover plate 11, and a flat surface covering the black matrix 12 and the color filter layer 13. layer 14, and the second auxiliary electrode unit 18, the color filter layer 13 includes a red color filter, a green color filter and a blue color filter, and the black matrix 12 and the color filter layer 13 are arranged at intervals. Wherein, the second auxiliary electrode unit 18 includes a spacer column 181 , a second auxiliary electrode 182 and an auxiliary conductive column 183 . The material of the spacer post 181 is a photoresist material, which runs through the flat layer 14 at the position of the black matrix 12, one end of which is connected to the black matrix 12, and the other end extends out of the flat layer 14; the second auxiliary electrode 182 is covered in the black matrix 12; the aux...

Embodiment 3

[0094] Such as Figure 17 As shown, the package cover plate 10 provided in this embodiment includes a plurality of auxiliary electrode units, and each auxiliary electrode unit can be arranged in an array, wherein the auxiliary electrode unit includes both the first auxiliary electrode unit 17 in Embodiment 1 and the first auxiliary electrode unit 17 in Embodiment 2. The second auxiliary electrode unit 18 in. That is, the first auxiliary electrode unit 17 includes a light guide column 171 and a first auxiliary electrode 172. The light guide column 171 is formed on the surface of the flat layer 14 and corresponds to the position of the color filter layer 13, and is far away from the flat layer. The width in the direction of 14 tapers to form inclined sidewalls; the first auxiliary electrode 172 is located in the gap between adjacent light guide columns 171, and has a first segment 1721 formed on the surface of the flat layer 14 corresponding to the position of the black matrix 1...

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Abstract

The invention relates to the technical field of display equipment, in particular to a packaging cover plate and a preparation method thereof, and further relates to a display panel and a display device comprising the packaging cover plate. The packaging cover plate comprises a cover plate, a black matrix, a color film, a flat layer and a first auxiliary electrode unit arranged on the flat layer. The first auxiliary electrode unit comprises a light guide column and a first auxiliary electrode, the light guide column is formed on the surface of the flat layer and corresponds to the color film layer in position, and the width of the light guide column is gradually reduced in the direction away from the flat layer to form an inclined side wall; the first auxiliary electrode is located in the gap between the adjacent light guide columns and is provided with a first section formed on the surface of the flat layer and corresponding to the black matrix in position and a second section formed on the inclined side walls of the light guide columns. The first auxiliary electrode has a large area, when the packaging cover plate and the display substrate are in press fit, it can be avoided that the electrodes are damaged and embrittled to affect the conductive effect due to large press fit force, in addition, light reflection can be assisted, a light emitting circuit can be restrained, and pixel lateral light leakage can be prevented.

Description

technical field [0001] The present invention relates to the technical field of display devices, in particular, to a package cover plate, and to a display panel and a display device including the package cover plate. Background technique [0002] In recent years, organic electroluminescent display (OLED) is a display lighting device that has gradually developed in recent years. Especially in the display industry, it is considered to have a wide range of application prospects due to its advantages of high response, high contrast, and flexibility. . In particular, top-emitting OLED devices have become the main direction of research due to their higher aperture ratio and the use of microcavity effects to optimize light extraction. For the top emission structure, the top electrode as the light emitting surface of the OLED must have good light transmittance. At present, the top-emitting transparent electrodes are mostly made of thin metal, ITO, IZO and other materials. Due to th...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/12H10K50/824H10K50/84
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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