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Tray capable of eliminating warping of wafers

A wafer and warpage technology, applied in the field of trays to eliminate wafer warpage, can solve the problems of reducing yield and stability, generating stress, affecting component uniformity, etc., and maintaining the temperature field and flow field. Stable and reliable, eliminating the effects of different thermal expansion coefficients and lattice constants

Inactive Publication Date: 2015-04-22
REDSOLAR NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, stress due to lattice mismatch and thermal mismatch
Stress is the warping of the epitaxial wafer, which makes it poorly connected with the base, and will generate dislocations, affect the uniformity of the composition, and even cracks
As the size of the substrate (wafer) becomes larger, the epitaxial warpage becomes more serious, which reduces the yield and stability, and affects the subsequent chip preparation process

Method used

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  • Tray capable of eliminating warping of wafers
  • Tray capable of eliminating warping of wafers
  • Tray capable of eliminating warping of wafers

Examples

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with specific examples.

[0021] The tray capable of eliminating warpage of wafers described in this embodiment is made of high-temperature-resistant materials, usually high-purity graphite or silicon carbide, and can be coated with coatings such as silicon carbide and tantalum carbide as required.

[0022] Such as Figure 1 to Figure 4 As shown, the tray includes a circular base 1 (the shape of the base can be selected from other shapes, such as square, polygon, etc.) and a circular base 2 for mounting wafers, wherein the There are three circular pits 3 formed on one side of the substrate 1, the number of the pits 3 is consistent with the base 2, and one pit 3 is equipped with a base 2, the shape and size of the base 2 is the same as that of the pit 3 matches. The base 2 is embedded in the corresponding pit 3, and there is a gap between the base 2 and the bottom of the pit for air to flow through wh...

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Abstract

The invention discloses a tray capable of eliminating warping of wafers. The tray comprises a base body and bases, a plurality of concave pits are formed in one side face of the base body, and one base is arranged in each concave pit. The bases are embedded in the corresponding concave pits, gaps are kept between the bases and the bottoms of the concave pits, and the overall height of the bases is smaller than the depth of the concave pits. A plurality of air suction holes are formed in the upper surfaces of the bases, and after the wafers are sucked on the bases, the overall combined height of the wafers and the bases is smaller than the depth of the concave pits. A vacuumizing channel communicated with the air suction holes is formed in each base, and the vacuumizing channels penetrate through the lower surfaces of the bases. Air exhaust holes are formed in the bottoms of the concave pits, a vacuumizing channel communicated with the air exhaust holes is formed in the base body, and the vacuumizing channel penetrates through the other side face of the base body and can be connected with an outside vacuumizing device. According to the tray, the wafers can be flatly attached to the bases, the epitaxial wafer warping problem caused by thermal mismatch and lattice mismatch can be effectively solved, the temperature in the wafers is uniform, and the subsequent technology processes are facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment manufacturing, in particular to a tray for eliminating wafer warpage. Background technique [0002] Energy is an important material basis for human survival and development, and it is also the focus of international politics, economy, military and diplomacy. With the increase of population and the acceleration of industrialization, the demand for energy in countries around the world is increasing, and the situation of energy shortage will become more and more obvious. At the same time, the environmental pollution caused by the development and utilization of fossil energy has become increasingly serious, which has seriously affected social and economic development and human health. It is extremely important to improve energy efficiency, reduce energy consumption, and develop new energy industries. [0003] In order to improve energy efficiency, reduce costs and carry out mass prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/302
CPCH01L21/6838
Inventor 张杨张露杨翠柏张小宾毛明明潘旭刘建庆王智勇
Owner REDSOLAR NEW ENERGY TECH
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