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A kind of manufacturing method of local thick copper circuit board and local thick copper circuit board

A local thick copper and production method technology, applied in the production of local thick copper circuit boards, in the field of local thick copper circuit boards, can solve the problems of under-corrosion, over-corrosion, film sandwiching, etc., achieve smooth outer surface and save assembly space Effect

Active Publication Date: 2017-12-12
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides a method for manufacturing a partial thick copper circuit board and a partial thick copper circuit board, so as to solve the above-mentioned defects of sandwich, over-corrosion or under-corrosion existing in the existing partial thick copper circuit board manufacturing process

Method used

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  • A kind of manufacturing method of local thick copper circuit board and local thick copper circuit board
  • A kind of manufacturing method of local thick copper circuit board and local thick copper circuit board
  • A kind of manufacturing method of local thick copper circuit board and local thick copper circuit board

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Embodiment 1

[0035] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a local thick copper circuit board, which may include:

[0036] 110. Provide a thick copper substrate, a first laminate and a first insulating bonding layer, the first surface of the thick copper substrate has a first thick copper circuit, and the first surface of the first laminate has a first thin copper For wiring, a first through-groove matching the first thick copper wiring is opened on the first insulating adhesive layer.

[0037] For thick copper lines and thin copper lines belonging to the same layer but with different thicknesses in the design scheme, the existing technology is to use the process of partial electroplating thickening or local etching thinning on the same metal layer of the copper clad laminate, but it is inevitable There will be problems such as film trapping, over-corrosion or under-corrosion.

[0038] In the embodiment of the present inventi...

Embodiment 2

[0070] Please refer to Figure 7 , an embodiment of the present invention provides a method for manufacturing a local thick copper circuit board, which may include:

[0071] 710. Provide a thick copper substrate, an insulating adhesive layer and a metal layer, one side of the thick copper substrate has a thick copper circuit, and the insulating adhesive layer and the metal layer have slots matching the thick copper circuit.

[0072] In this embodiment, a thick copper substrate with corresponding copper thickness is provided according to the thickness of the thick copper circuit to be formed; a metal layer with a corresponding thickness is provided according to the thickness of the thin copper circuit to be formed; according to the thickness of the thick copper circuit and the thin copper circuit, The difference in thickness provides an insulating bonding layer of corresponding thickness. Generally, the thickness of thick copper lines can be above 5oz or 8oz; the thickness of ...

Embodiment 3

[0113] Please refer to Figure 10 , an embodiment of the present invention provides a method for manufacturing a local thick copper circuit board, which may include:

[0114] 1010. Etch the first surface of the metal layer, wherein the non-circuit pattern part of the thick copper circuit area and the thin copper circuit area are etched to reduce the thickness.

[0115] In the embodiment of the present invention, thick copper lines and thin copper lines are fabricated on the metal layer by performing double-sided etching on the metal layer. Said metal layer can specifically be thicker copper foil layer or copper plate, etc., and its thickness can be more than 0.35 mm, or more than 10 oz (oz, 1 oz is about 35 microns). In this embodiment, assuming that the thicknesses of the thick copper circuit and the thin copper circuit are required to be 10 oz and 5 oz respectively, a metal layer of the same thickness can be blanked according to the size of the required thick copper circuit...

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PUM

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Abstract

The invention discloses a method for manufacturing a local-thick-copper circuit board and the local-thick-copper circuit board. The method and the local-thick-copper circuit board aim at overcoming the defects existing in the technology for manufacturing the local-thick-copper circuit board through existing local electroplating or existing local etching. The method includes the steps that a thick copper substrate, a first laminated board and a first insulating bonding layer are provided, wherein a first thick copper circuit is arranged on the first face of the thick copper substrate, a first thin copper circuit is arranged on the first face of the first laminated board, and a first through groove matched with the first thick copper circuit is formed in the first insulating bonding layer; the thick copper substrate, the first insulating bonding layer and the first laminated board are pressed to enable the first thick copper circuit to abut against an insulating layer of the first face, provided with the first thin copper circuit, of the first laminated board through the first through groove, and the local-thick-copper circuit board with the first thin copper circuit and the first thick copper circuit on the same layer is obtained.

Description

[0001] This application claims the priority of the Chinese patent application filed on December 12, 2013 with the application number 201310684084.0 and the title of the invention "A Method for Making Partially Thick Copper Circuit Board" with the China Patent Office, the entire contents of which are hereby incorporated by reference In this application. technical field [0002] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a partially thick copper circuit board and the partially thick copper circuit board. Background technique [0003] For partial thick copper circuit boards with circuits of different thicknesses on the same circuit layer, partial electroplating or partial etching or a combination of the two methods are generally used in the prior art. [0004] For example, the area on the copper foil layer that needs to be made of thick copper lines can be thickened by electroplating, the area on the copper foil l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/00
CPCH05K1/00H05K3/02H05K3/107H05K3/46H05K3/4614H05K2201/0367
Inventor 沙雷崔荣刘宝林
Owner SHENNAN CIRCUITS