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Circuit board manufacturing method and circuit board embedded with metal base

A circuit board production, metal-based technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit connected with non-printed electrical components, etc., to achieve the effect of good surface flatness, simple process and low cost

Active Publication Date: 2018-02-23
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a circuit board manufacturing method and a circuit board embedded with a metal base to solve the above-mentioned various defects caused by the use of local electroplating or local micro-etching processes in the prior art to make local thick copper

Method used

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  • Circuit board manufacturing method and circuit board embedded with metal base
  • Circuit board manufacturing method and circuit board embedded with metal base
  • Circuit board manufacturing method and circuit board embedded with metal base

Examples

Experimental program
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Embodiment 1

[0026] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a circuit board, which may include:

[0027] 110. Provide a metal base and an inner layer board with thick copper traces on at least one side of the inner layer board.

[0028] In the embodiment of the present invention, the corresponding thickness of the metal base required can be calculated according to the magnitude of the current that needs to be carried by the surface layer of the circuit board, the plane size of the metal base that can be accommodated on the circuit board, and the characteristics of the metal base itself. Then blank the metal plate with the corresponding thickness, and mill the metal base of the corresponding size according to the plane size of the metal base on the surface of the circuit board by milling the shape. And the burrs around the metal base can be removed by grinding. Finally, the metal base can also be browned. The metal base may be...

Embodiment 2

[0044] Please refer to Figure 2d , an embodiment of the present invention provides a circuit board embedded with a metal base, which may include:

[0045] The outer thin copper circuit layer 33, the insulating layer 32, the inner thick copper circuit layer 21 and the metal base 50; the metal base 50 is embedded in the outer thin copper circuit layer 33 but not through the insulating layer 32 In the groove 40; at least one via hole 71 runs through the metal base 50 and reaches or penetrates into the inner thick copper wiring layer 21, and the metal base 50 and the inner thick copper wiring layer 21 pass through the The via hole 71 is connected.

[0046] Optionally, the metal base 50 has a metallized through hole 72 at its boundary.

[0047] Optionally, the outer surface of the metal base 50 and the outer surface of the outer thin copper circuit layer 33 are located on the same plane.

[0048] Such as Figure 2e The point circuit board plan view shown, in some embodiments o...

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Abstract

The invention discloses a method for making a circuit board and a circuit board embedded with a metal base to solve various defects in the prior art caused by using local electroplating or local micro-etching processes to manufacture local thick copper. In some embodiments of the present invention, the above-mentioned circuit board manufacturing method includes: providing a metal base and an inner layer board, at least one side of the inner layer board has a thick copper circuit; Outer layer board, and the metal base is placed in the non-penetrating groove opened on the outer layer board, the groove is located on the side of the outer layer board away from the inner layer board; the thick The copper circuit and the outer layer board and the metal base are pressed together; the metal base is processed on the metal base to reach or go deep into the conduction hole of the thick copper circuit, so that the metal base and the thick copper circuit Connecting through the via hole; making an outer layer circuit on the outer layer board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board manufacturing method and a circuit board embedded with a metal base. Background technique [0002] In order to facilitate the input and output of large currents, the circuit boards of power supplies and other products generally use thick copper embedded in the inner layer as the carrier for carrying large currents. If the current needs to be output to a local area on the surface of the circuit board, it is also necessary to make local thick copper on the surface of the circuit board. In the prior art, a local electroplating or local micro-etching process is used to make local thick copper on the surface layer of the circuit board. [0003] However, due to the unevenness of electroplating or micro-etching, the copper thickness of each part of the surface layer of the circuit board treated by the above two processes is very different, and the flatness is ext...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/00
Inventor 沙雷崔荣刘宝林
Owner SHENNAN CIRCUITS