Transmission system and semiconductor processing equipment

Abstract

The invention provides a transmission system and a semiconductor processing device. The transmission system comprises a mechanical arm, wherein the upper surface of the mechanical arm is used for bearing the workpiece to be processed; at least one concave channel is formed in the upper surface of the mechanical arm, at least one end of each concave channel extends towards the boundary of the mechanical arm along the radial direction of the mechanical arm, each concave channel and the lower surface of the workpiece to be processed can form the air flow passage, thus the air flow between the mechanical arm and the workpiece to be processed can be discharged through the air flow passage. The transmission system can effectively prevent the workpiece to be processed from slipping relative to the mechanical arm, improve the stability of the transmission system, improve the transmission quality of the transmission system and improve the applicability of the transmission system.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a transmission system and semiconductor body processing equipment. Background technique [0002] Semiconductor processing equipment is a widely used processing equipment, mainly through plasma coating, etching and other processes on substrates and other processed workpieces. In semiconductor equipment, it is often necessary to transfer unprocessed workpieces into the reaction chamber by means of a transport system, and transfer processed workpieces out of the reaction chamber. [0003] figure 1 It is a structural schematic diagram of the manipulator in the existing transmission system. see figure 1 , the transmission system includes a manipulator 11 . Wherein, at least three small protrusions 12 are arranged on the upper surface of the manipulator 11, and the top ends of the at least three small protrusions 12 are used to carry the workpiece S ...

AI Technical Summary

Problems solved by technology

[0004] However, the use of the above-mentioned transmission system inevitably has the following problems in practical applications: since the manipulator 11 supports the processed workpiece S through at least three small protrusions 12, the contact area and friction between the processed workpiece S and the manipulator 11 are small, Therefore, during the acceleration or deceleration of the manipulator 11, and when the processed workpiece S rubs against other components, it is easy to cause the position of the processed workpiece S to move on the manipulator 11 or even fall off from the manipulator 11. It will have a negative impact on the follow-up work, and even cause a high fragmentation rate, resulting in low economic benefits

Moreover, when the workpiece to be processed is a bonded sheet with large warpage and soft material, the workpiece to be processed is prone to warpage, resulting in poor process quality.

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