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Carrier tape molding die and carrier tape molding device

A technology of forming molds and forming molds, which is applied to belts, household appliances, and other household appliances. It can solve problems such as slippage and displacement, tensile deformation of the carrier tape, and influence on the accuracy of each accommodation hole of the carrier tape. It achieves high precision, The effect of simple structure

Inactive Publication Date: 2015-07-29
OMS MASCH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many ways to process and form the receiving hole of the carrier tape, some of which need to heat and soften the flat and shaped carrier tape to enter the mold for intermittent molding. , and when the pulling force of the pulling device acts on the carrier tape, it will not only cause tensile deformation of the softened carrier tape, but also produce deflection and displacement during the conveying process, which will affect the accuracy of the forming holes of the carrier tape. It will also affect the accuracy of subsequent drilling

Method used

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  • Carrier tape molding die and carrier tape molding device
  • Carrier tape molding die and carrier tape molding device
  • Carrier tape molding die and carrier tape molding device

Examples

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Embodiment Construction

[0029] as attached figure 1 to attach Figure 4 The shown carrier tape forming device includes an organic table 1 , a carrier tape forming mold 2 and a heating mechanism 3 .

[0030] The machine 1 has a fixed shaft 11, one end of the fixed shaft 11 is covered with a bearing seat 12 under the table of the machine 1, and the side of the other end of the fixed shaft 11 is provided with a hole that can communicate with external equipment to generate a vacuum. The suction opening 11 - 1 is on the table top of the machine 1 . Specifically, refer to 6 and Figure 9 As shown, the other end of the fixed shaft 11 away from the adsorption opening 11-1 is penetrated inwardly with a gas flow channel 11-2 communicating with the adsorption opening 11-1. The gas flow channel 11-2 includes a The central passage 11-2a extending axially of the fixed shaft 11 and the radial passage 11-2b connecting the suction opening 11-1 and the central passage 11-2a.

[0031] Refer to attached Figure 5 t...

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Abstract

The invention relates to a carrier tape molding die and a carrier tape molding device. The carrier tape molding device comprises a machine table, the carrier tape molding die and a heating mechanism, wherein the carrier tape molding die is rotationally arranged on a fixed shaft; the side face of one end of the fixed shaft is provided with an adsorption opening which can be communicated with external equipment to generate vacuum; the die is wheel-shaped, and the outer peripheral face of the die is provided with a plurality of grooves; each groove is provided with an air channel; when the molding die rotates relative to the fixed shaft, the air channel of each groove can be communicated with the adsorption opening in sequence. The carrier tape molding die and the carrier tape molding device have the advantages of simple structure, capability of continuously machining accommodating holes of carrier tapes and high accuracies of the processed accommodating holes.

Description

(1) Technical field [0001] The invention relates to a carrier tape molding die and a carrier tape molding device. (2) Background technology [0002] Carrier tape refers to the plastic carrier widely used in the packaging of SMT electronic components such as IC, resistors, inductors, capacitors, connectors, LEDs, fuses, switches, relays, connectors, oscillators, diodes, and triodes. Usually, the carrier tape has The accommodating hole of a certain shape is used for accommodating the above-mentioned accessories. [0003] There are many ways to process and form the receiving hole of the carrier tape, some of which need to heat and soften the flat and shaped carrier tape to enter the mold for intermittent molding. , and when the pulling force of the pulling device acts on the carrier tape, it will not only cause tensile deformation of the softened carrier tape, but also produce deflection and displacement during the conveying process, which will affect the accuracy of the formi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/00B29C35/02B29D29/00
Inventor 龙晓斌王定戒王浩雄宋俊锡黄乃敏
Owner OMS MASCH CO LTD