Multi-Layer Antenna Structures and Antennas

Active Publication Date: 2018-01-02
BAICELLS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Embodiments of the present invention provide a multi-layer antenna structure and antenna to at least solve the technical problem that the antenna cannot meet the performance and thickness requirements

Method used

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  • Multi-Layer Antenna Structures and Antennas
  • Multi-Layer Antenna Structures and Antennas
  • Multi-Layer Antenna Structures and Antennas

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Embodiment Construction

[0027] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0028] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...

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PUM

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Abstract

The invention discloses a multilayer antenna structure and antenna. The multi-layer antenna structure includes an upper dielectric substrate, an intermediate dielectric substrate, a lower dielectric substrate and a reflector arranged in sequence, wherein: the upper surface of the upper dielectric substrate is provided with a parasitic patch; the intermediate dielectric substrate and the upper dielectric substrate are arranged at intervals. The upper surface of the intermediate dielectric substrate is provided with a radiation patch, and the lower surface is integrally attached with a first metal grounding layer; the upper surface of the lower dielectric substrate is arranged in close contact with the lower surface of the intermediate dielectric substrate, and the lower surface of the lower dielectric substrate is provided with The feeding structure has a second metal ground layer attached to the entire upper surface, wherein the feeding structure and the radiation patch are connected through metal probes; and the reflector is located on the lower surface side of the lower dielectric substrate, and there is an air layer between the lower dielectric substrate and the lower dielectric substrate. . The invention solves the technical problem that the performance and thickness requirements of the antenna cannot be balanced.

Description

technical field [0001] The present invention relates to the field of antennas, in particular to a multilayer antenna structure and antenna. Background technique [0002] In various wireless devices, the antenna is a very important component, and its main function is to transmit and receive wireless signals. With the continuous development of antenna technology, there are higher requirements for the radiation performance, reception performance and aesthetics of the antenna itself. [0003] The 5GHz frequency band is an internationally common license-free frequency band. There are a large number of wireless devices in this frequency band. Due to the size limitation of various wireless devices, the size of the antenna needs to be further compressed, and at the same time, it is necessary to ensure a good antenna performance. However, when the thickness of the existing antenna is relatively thin, it cannot achieve better antenna performance (such as relative bandwidth, etc.); w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/50H01Q19/10H01Q1/48
Inventor 白炜刘建江刘艳明
Owner BAICELLS TECH CO LTD
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