Unlock instant, AI-driven research and patent intelligence for your innovation.

Material Bonding Equipment

A material bonding and equipment technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as inclination, and achieve the effect of efficient operation

Active Publication Date: 2017-09-15
PROTEC CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the height of the stopper part (3) is inconsistent or the distribution state of the first material (11) in the through hole (2) is unstable, the first material (11) cannot be horizontally distributed inside the through hole (2), often In case of tilt

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Material Bonding Equipment
  • Material Bonding Equipment
  • Material Bonding Equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The material bonding apparatus according to the present invention will be described in detail below with reference to the drawings.

[0041] figure 2 is a perspective view of a material bonding apparatus according to one embodiment of the present invention, image 3 yes figure 2 Top view of the material bonding equipment shown, Figure 4 is to remove figure 2 Perspective view of a part of the structure of the upper side of the material bonding equipment shown after.

[0042] The material bonding equipment of the present invention is a kind of figure 1 The equipment for adhering the second material (12) on the first material (11) supplied is placed on the tray (1) shown. The main body part (5) of the tray (1) is formed in the shape of a square plate, through-holes (2) are formed at regular intervals on the upper surface thereof, and each through-hole (2) is provided with a stopper part (3). The through hole (2) is formed in a square shape, and is formed in a siz...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an apparatus for bonding materials and specifically provides an apparatus for bonding materials which can bond second materials to a plurality of first materials separately and successively. The apparatus for bonding materials can stick second materials quickly and stably through pressurization to first materials with the upper surface coated with adhesive. The apparatus for bonding materials can stick second materials quickly and stably through pressurization to a plurality of first materials. The apparatus for bonding materials can successively stick second materials through pressurization with respect to first materials with high efficiency.

Description

technical field [0001] The present invention relates to a material bonding facility. More specifically, the present invention relates to a material bonding facility for sequentially bonding a second material to a plurality of first materials. Background technique [0002] In the manufacturing process of various electronic products such as semiconductor process, the process of bonding the second material on the surface of the first material is widely used, similar to bonding a lid (lid) on the surface of the semiconductor chip or attaching a lid to the surface of the semiconductor package. . In recent years, a process of stacking a plurality of semiconductor chips or a plurality of substrates to manufacture electronic elements or electronic parts has also been used. [0003] In this stacking step, the first material is supplied in a state where the adhesive is applied to the position where the second material is to be attached. At this time, after the second material is dis...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67121H01L21/67144H01L24/75
Inventor 高允成金在成
Owner PROTEC CO LTD