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A kind of multi-wafer grinding device and grinding method thereof

A grinding device and multi-chip technology, applied in grinding devices, grinding machine tools, grinding machines, etc., can solve the problems of low work efficiency and high equipment cost, and achieve the effect of improving work efficiency and ensuring smoothness

Active Publication Date: 2017-07-14
福州恒光光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing high-precision machine grinders generally grind a single crystal, which has low work efficiency and high equipment cost, and is not suitable for large-scale production

Method used

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  • A kind of multi-wafer grinding device and grinding method thereof
  • A kind of multi-wafer grinding device and grinding method thereof
  • A kind of multi-wafer grinding device and grinding method thereof

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Experimental program
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Embodiment Construction

[0024] The present invention will be further described below with reference to the drawings and specific embodiments.

[0025] Such as Figure 1~3 As shown, a multi-wafer grinding device of this embodiment includes a frame 1, and two grinding disc groups are symmetrically provided on the upper end surface of the frame 1, and both grinding disc groups are driven to rotate by a driving mechanism, and further include Two swing mechanisms 4 arranged symmetrically on the left and right and respectively used for swinging amplitude according to the track on the two grinding disc groups, the swing mechanism 4 is driven by the drive mechanism, and the swing mechanism 4 is connected with a photoresist for fixing A fixed seat which is arranged in a longitudinal direction, a plurality of chips are symmetrically attached to the photo-plastic plate, and the photo-plastic plate is arranged in the fixed seat and the surface where the wafer is attached faces downward.

[0026] It can be seen from ...

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PUM

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Abstract

The invention relates to a multi-wafer grinding device and method. The multi-wafer grinding device comprises a rack. Two grinding disc sets are arranged on the upper end face of the rack in a bilateral symmetry mode and are driven to rotate by a driving mechanism. The grinding device further comprises two swing mechanisms which are arranged in a bilateral symmetry mode and used for swinging on the two grinding disc sets according to tracks respectively. The swing mechanisms are driven by the driving mechanism and connected with fixing seats which are used for fixing optical cement boards and longitudinally arranged. A plurality of wafers are symmetrically pasted to the optical cement boards which are arranged in the fixing seats, and the faces, where the wafers are pasted, of the optical cement boards are downward. The multi-wafer grinding device has the beneficial effects that the multiple wafers are pasted to the optical cement boards to be coarsely ground and finely ground; the two grinding disc sets of the device can grind the wafers on the two optical cement boards at the same time, so that work efficiency is improved; moreover, the grinding device is simple in structure and convenient to operate.

Description

Technical field [0001] The present invention relates to the field of wafer grinding, in particular to a multi-wafer grinding device and a grinding method thereof. Background technique [0002] As a light-transmitting equipment of imaging equipment, wafers need to be polished and polished on the surface of the wafer during processing. When polishing wafers, a grinder is usually required. Existing high-precision grinding machines generally use a single crystal for grinding, which has low work efficiency and high equipment cost, which is not suitable for large-scale production. Summary of the invention [0003] The purpose of the present invention is to provide a multi-wafer polishing device and a polishing method for the above shortcomings to improve polishing efficiency. [0004] The solution adopted by the present invention to solve the technical problem is: a multi-chip grinding device including a frame, the upper end surface of the frame is provided with two grinding disc groups ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10B24B27/00
CPCB24B27/0076B24B37/10
Inventor 陈从贺
Owner 福州恒光光电有限公司