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Camera module group and first and second circuit boards thereof

A technology of camera modules and circuit boards, which is applied in the direction of image communication, TV, color TV parts, etc., can solve the problems of increased production costs, micro-camera module manufacturing sample cycle (long proofing cycle, etc.)

Inactive Publication Date: 2015-11-25
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the manufacturing sample cycle (proofing cycle) of the miniature camera module is longer, resulting in increased production costs

Method used

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  • Camera module group and first and second circuit boards thereof
  • Camera module group and first and second circuit boards thereof
  • Camera module group and first and second circuit boards thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The camera module and its first circuit board and second circuit board will be further described below in conjunction with the drawings and specific embodiments.

[0039] like figure 1 As shown, the camera module 10 of an embodiment includes a first circuit board 100 , a second circuit board 200 , an image sensing chip 300 , a bracket 400 , a filter 500 and a lens assembly 600 .

[0040] like figure 1 and figure 2 As shown, the first circuit board 100 includes a ceramic substrate 110 , a basic circuit (not shown) integrated in the ceramic substrate 110 and two sets of first golden fingers (not shown).

[0041] The ceramic substrate 110 has a mounting surface 112 and a connecting surface 114 opposite to each other, and a side surface 116 connecting the mounting surface 112 and the connecting surface 114 . The mounting surface 112 is used for mounting the image sensor chip 300 . A card slot 118 is formed inwardly on the side surface 116 . The slot 118 has a first in...

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Abstract

The invention relates to a camera module and first and second circuit boards thereof. The first circuit board comprises a ceramic substrate and a basic circuit which is integrated in the ceramic substrate, wherein the ceramic substrate is provided with an installation surface, a connection surface, and a side surface which is used for connecting the installation surface and the connection surface. The installation surface is used for installing an image sensing chip of the camera module group, and the side surface is recessed to form a card slot. The card slot is provided with a first inner wall and a second inner wall, wherein the first inner wall is close to the installation surface. The first circuit board also comprises two groups of first golden fingers which are respectively disposed on the first and second inner walls and are respectively connected with the basic circuit in an electrical manner. The card slot is in pluggable connection with the second circuit board of the camera module group, so as to enable the circuit board to be electrically connected with an external circuit board through the two groups of first golden fingers and the second circuit board of the camera module group. The first circuit board is used in the camera module group, thereby effectively shortening the manufacturing period of a sample.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to a camera module and a first circuit board and a second circuit board thereof. Background technique [0002] A miniature camera module usually includes a circuit board, an image sensor chip, a bracket, a filter, and a lens assembly. At present, there are mainly two design structures of the circuit board: (1) The circuit board includes a printed circuit board (PCB) and a flexible circuit board (FPC). At this time, the image sensor chip, bracket, filter and lens assembly are installed on one end of the PCB, and the other end of the PCB is pressed and connected to the FPC, and the end of the FPC away from the PCB is used for electrical connection with an external circuit board (such as , motherboards of electronic products). (2) The circuit board is a whole piece of FPC and a reinforcement board is pasted on the back of a part of the flexible circuit board. At this time, ...

Claims

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Application Information

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IPC IPC(8): H04N5/225
Inventor 于立新
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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