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Fine line circuit board processing method and circuit board processing system

A technology of fine lines and processing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve the problems of low production efficiency of front and back etching processes, discrepancies between actual and theoretical conditions, and inoperability of front and back etching processes, etc. , to achieve the effect of reducing open circuit or short circuit and unqualified line width, solving open circuit or short circuit and unsuitable line width, and saving engineering production time

Inactive Publication Date: 2015-11-25
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the production efficiency of the front and back etching process is low, and the operation is cumbersome; moreover, when the copper thickness is thin, the front and back etching process may not be operable
The dynamic compensation scheme takes a long time in the engineering production stage, and it is prone to problems that the actual situation and the theoretical situation do not match, resulting in multiple compensations; and when the fine line spacing is too small, the dynamic compensation may not be able to operate because the line spacing is too small

Method used

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  • Fine line circuit board processing method and circuit board processing system
  • Fine line circuit board processing method and circuit board processing system

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Embodiment 1

[0023] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a fine circuit board, which may include:

[0024] 110. Etching the non-circuit pattern area on the surface of the circuit board, the etching depth is less than or equal to 1 / 4 of the thickness of the metal layer on the surface of the circuit board.

[0025] In the embodiment of the present invention, in order to improve the uniformity of etching, the conventional one-time etching is decomposed into multiple etchings. The multiple times of etching are at least four times, and the etching depth of each etching is at least 1 / 4 of the thickness of the metal layer on the surface of the circuit board.

[0026] Wherein, before etching, a surface treatment step may be included, for example, it may specifically include cleaning and micro-etching, etc. to remove dirt and oxides on the surface of the circuit board to facilitate subsequent treatment.

[0027] In this step, before et...

Embodiment 2

[0040] Please refer to figure 2 , the embodiment of the present invention provides a circuit board processing system, the system includes: at least four sets of etching segment devices 200; wherein each group of etching segment devices includes:

[0041] The etching tank device 201 is used to etch the non-line pattern area on the surface of the circuit board, and the etching depth is less than or equal to a quarter of the thickness of the metal layer on the surface of the circuit board;

[0042] Cleaning equipment 202, cleaning the circuit board etched through the etching tank;

[0043] Turning device 203 is used to turn over the circuit board cleaned by the cleaning device so that the other side of the circuit board faces upward.

[0044] In some embodiments of the present invention, the system also includes:

[0045] a film removing device, used to remove the resist film provided on the circuit board;

[0046] a cleaning device, used to clean the circuit board after film...

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PUM

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Abstract

The invention discloses a fine line circuit board processing method and a circuit board processing system. The etching uniformity during manufacturing of a fine line is raised. The method comprises steps: a non-circuit graph region on a surface of a circuit board is subjected to etching, and the etching depth is less than or equal to quarter of a thickness of a surface metal layer of the circuit board; the circuit board is cleaned; the circuit board is overturned, and thus the other surface of the circuit board faces up; the above etching, cleaning and overturning steps are repeated for multiple times until the surface metal layer of the non-circuit graph region on the surface of the circuit board is removed completely through etching, and a needed circuit graph is formed.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a processing method and a circuit board processing system for fine-density circuit boards. Background technique [0002] There are more and more applications of fine lines in circuit board products. When making fine lines, if the etching is not uniform, there will be over-corrosion or under-corrosion of the lines, resulting in open or short circuits between the fine lines, and the line width is unqualified, resulting in unqualified impedance of the circuit board product. [0003] In the conventional fine line etching process, in order to prevent uneven etching, it is usually improved by front and back etching processes, or by a dynamic compensation scheme that compensates inconsistent lines in different areas. [0004] However, the production efficiency of the front and back etching process is low, and the operation is cumbersome; moreover, when the copper thickness is th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
Inventor 王蓓蕾刘宝林缪桦
Owner SHENNAN CIRCUITS
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