Printed circuit board and manufacturing method thereof

Abstract

Provided are a printed circuit board and a fabrication method therefor. The fabrication method for the printed circuit board comprises the following steps: lamination structure design (S1), impedance design (S2), board cutting and impedance optimization design (S3), fabrication of inner layer wiring (S4), and post-processing to form a printed circuit board with a multilayer board structure (S5). According to the printed circuit board and the fabrication method therefor, by monitoring and adjusting the various factors affecting impedance values in production processes of board cutting and fabrication of inner layer wiring, difficulties in controlling inner layer impedance of printed circuit boards in a production process can be resolved, and the inner layer impedance of the printed circuit boards can be stably controlled to meet the requirement for high precision, improving high-speed signal transmission performance of the printed circuit boards, and thereby improving the impedance yield of printed circuit boards, reducing impedance rejection rates, decreasing production costs, and reducing delivery delays due to poor impedance.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] As the PCB (Printed Circuit Board, printed circuit board) tends to develop in the direction of high speed and high frequency, the impedance control precision of the PCB is getting higher and higher. The impedance control accuracy of PCB products is generally ±10%, and some high-end products require impedance control to achieve higher accuracy, such as ±7% or ±5%, and the number of such products is increasing. [0003] Traditionally, when designing the impedance of a PCB, some impedance calculation software is usually used to simulate and predict the impedance, and then select a suitable control scheme according to customer requirements such as stacked structure, line width, and dielectric layer thickness. During production, it is produced according to the control scheme durin...

AI Technical Summary

Problems solved by technology

However, since there are many factors affecting PCB impedance, and the PCB manufacturing process is relatively cumbersome, the products obtained by traditional methods, especially those that require high-precision impedance control, have a poor impedance pass rate, which leads to high product scrap rates and high production costs. High cost, product delivery delays

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