Production process of multilayered fine circuit board and circuit board processing system

Abstract

The invention discloses a production process of a multilayered fine circuit board. The production process comprises the following steps of S1, performing etching on a non-circuit pattern region on thesurface of a circuit board, wherein the etching depth is less than or equal to 1 / 4 of the thickness of a surface metal layer of the circuit board; S2, performing cleaning on the circuit board, and turning cover the circuit board to enable the other surface of the circuit board to be upward; and S3, repeatedly executing the steps of etching, cleaning and turning over for multiple times until the surface metal layer in the non-circuit pattern region on the surface of the circuit board is fully etched off to form a needed circuit pattern. A technical scheme with etching of multiple times is adopted; in each etching stage, the etching depth is less than or equal to 1 / 4 of the thickness of the surface metal layer of the circuit board; through multiple etching stages, the needed circuit patternis formed finally; and finally, etching uniformity is improved entirely, and possibilities of open circuit or short circuit between the fine circuits and unqualified linewidth are reduced as far as possible, thereby further improving impedance percent of pass of the circuit board product.

Description

technical field [0001] The invention relates to a production process of a multi-layer fine circuit circuit board and a circuit board processing system. Background technique [0002] There are more and more applications of fine lines in circuit board products. When making fine lines, if the etching is not uniform, there will be over-corrosion or under-corrosion of the lines, resulting in open or short circuits between the fine lines, and the line width is unqualified, resulting in unqualified impedance of the circuit board product. [0003] In the conventional fine line etching process, in order to prevent uneven etching, it is usually improved by front and back etching processes, or by a dynamic compensation scheme that compensates inconsistent lines in different areas. [0004] The production efficiency of the front and back etching process is low, and the operation is cumbersome; moreover, when the copper thickness is thin, the front and back etching process may not be op...

AI Technical Summary

Problems solved by technology

[0004] The production efficiency of the front and back etching process is low, and the operation is cumbersome; moreover, when the copper thickness is thin, the front and back etching process may not be operable

The dynamic compensation scheme takes a long time in the engineering production stage, and it is prone to problems that the actual situation and the theoretical situation do not match, resulting in multiple compensations; and when the fine line spacing is too small, the dynamic compensation may not be able to operate because the line spacing is too small