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High-efficiency heat dissipation LED lights

An LED lamp and LED lamp board technology, which is applied to lighting and heating equipment, parts of lighting devices, semiconductor devices of light-emitting elements, etc. Improve the heat dissipation effect and ensure the sealing effect

Active Publication Date: 2018-07-06
永康市舒达康智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat conduction between the LED light board and the light body is through one or more layers of plastic shells or metal shells. The problems are: first, the heat dissipation effect is not good, and second, the production results are high.

Method used

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  • High-efficiency heat dissipation LED lights
  • High-efficiency heat dissipation LED lights
  • High-efficiency heat dissipation LED lights

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] refer to Figure 1-3 , an LED lamp with high heat dissipation, including a lamp base 1, a lamp body 2, an LED lamp board 6 and a lampshade 3, the LED lamp board 6 is installed in the lamp body 2, the lampshade 3 is located under the LED lamp board 6, and it also includes There are an upper cover 4, a lower cover 5 and a threading pipe 7, the threading pipe 7 is cylindrical and located in the center of the lamp body 2, the upper cover 4 is located above the threading pipe 7, the lower cover 5 is located below the threading pipe 7, the lamp body 2 , the upper cover 4, the wire pipe 7, and the lower cover 5 form a sealed heat dissipation chamber 8, and the heat dissipation chamber 8 is filled with superconducting liquid; the LED lamp board 6 is fixed under the lower cover 5, and the LED lamp board 6 The lead wire 9 is connected to the lamp head 1 through the threading pipe 7.

[0033] The upper cover 4 is in the shape of a ring, and the lower cover 5 is in the shape of a ...

Embodiment 2

[0044] The difference from Example 1 is that the composite fluorescent agent microporous material is prepared by the following steps:

[0045] (1) The activated carbon is homogeneously pulverized, and the particle size is controlled below 300 mesh;

[0046] (2) Mix activated carbon with ultraviolet fluorescent agent. The amount of ultraviolet fluorescent agent accounts for 0.5-5wt% of the activated carbon. The solid mixture is then mixed with liquid light-curable glue. The amount of light-curable glue accounts for 0.5-5wt% of the solid mixture;

[0047] (3) Under the irradiation of ultraviolet light, the product obtained in step (2) is spray-dried to obtain the activated carbon microporous material.

[0048] The working principle of this embodiment is the same as that of Embodiment 1.

Embodiment 3

[0050] The difference from Example 1 is that the composite fluorescent agent microporous material is prepared by the following steps:

[0051] (1) The expanded perlite is homogeneously crushed, and the particle size is controlled below 300 mesh;

[0052] (2) Mix perlite with ultraviolet fluorescent agent. The amount of fluorescent agent accounts for 0.5-5wt% of the activated carbon. The solid mixture is then mixed with liquid light-curable glue. The amount of light-curable glue accounts for 0.5-5wt% of the solid mixture;

[0053] (3) Under the irradiation of ultraviolet light, the product obtained in step (2) is spray-dried to obtain a perlite microporous material.

[0054] The working principle of this embodiment is the same as that of Embodiment 1.

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PUM

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Abstract

The invention relates to an LED lamp achieving efficient heat radiation. The LED lamp comprises a lamp holder, a lamp body, an LED lamp panel and a lampshade. The LED lamp panel is installed in the lamp body, and the lampshade is located below the LED lamp panel. The LED lamp further comprises an upper cover, a lower cover and a wiring pipe. The wiring pipe is cylindrical and is located in the center of the lamp body. The upper cover is located above the wiring pipe, and the lower cover is located below the wiring pipe. A sealed heat radiation cavity is defined by the lamp body, the upper cover, the wiring pipe and the lower cover, and superconducting liquid is contained in the heat radiation cavity. The LED lamp panel is fixed below the lower cover, and a wire of the LED lamp panel is connected with the lamp holder through the wiring pipe. The sealed heat radiation cavity is formed in the lamp body of the LED lamp, the superconducting liquid is adopted for heat radiation, so that the heat radiation effect is improved, and meanwhile production cost is reduced. Composite fluorescent agent cellular materials are dispersed in the superconducting liquid, therefore, the leakage condition of the heat radiation cavity can be detected in time, and the sealing performance of the heat radiation cavity is guaranteed.

Description

technical field [0001] The invention belongs to LED lamps, in particular to an LED lamp with efficient heat dissipation. Background technique [0002] With the development of LED, LED light source has the advantages of using low-voltage power supply, less energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color light emission. Therefore, the wide application of LED has become a development trend. [0003] Existing high-efficiency heat-dissipating LED lamps generally include a lamp cap, a lamp body, an LED lamp board, and a lampshade. The LED lamp board is installed in the lamp body, and the lampshade is located below the LED lamp board. The heat conduction between the LED light board and the light body is through one or more layers of plastic shells or metal shells. The problems are: first, the heat dissipation effect is not good, and second, the production results are high. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/232F21V29/58F21V31/00F21Y115/10
CPCF21V31/005
Inventor 何倩倩邓永恒
Owner 永康市舒达康智能科技有限公司