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A monitoring system and method

A technology for controlling signals and moving directions, applied in the field of electronics, can solve problems such as chip breakage and inability to detect, and achieve the effect of reducing the probability of fragmentation

Active Publication Date: 2018-02-16
FOUNDER MICROELECTRONICS INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present application provides a monitoring system and method to solve the technical problem that the existing film mounter cannot detect whether the film is broken and the chip is broken

Method used

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Embodiment Construction

[0028] In order to make the purpose, technical solution and advantages of the invention of the application clearer, the technical solution of the application will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the application and the specific features in the embodiments are It is a detailed description of the technical solution of the present application, rather than a limitation of the technical solution of the present application. In the case of no conflict, the embodiments of the present application and the technical features in the embodiments can be combined with each other.

[0029] It should be noted here that the term "and / or" appearing in this article is only an association relationship describing associated objects, which means that there can be three relationships, for example, A and / or B can mean: A exists alone, There are three situations where A and B e...

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Abstract

The present application discloses a monitoring system and method. The system includes: a first detection device, which is arranged on the film pulling device of a film laminating machine and the place to pass in the moving direction of the film pulling device, and is used to detect and obtain The first optocoupler signal of the film pulling device at the starting position of the film pulling, and the second photocoupler signal used to characterize the end position of the film pulling device; the second detection device is used to detect and obtain the signal used to characterize the film pulling device The first detection signal of the film-drawing device during the film-drawing process from the starting position to the end position; the control unit is connected with the first detection device and the second detection device for receiving and based on The first optocoupler signal and / or the second optocoupler signal, and the first detection signal generate and output a first control signal to control the film laminating machine to be in a stop state.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a monitoring system and method. Background technique [0002] With the wide application of semiconductors, manufacturers produce a large number of various semiconductor devices. In the production process of semiconductor devices, it is necessary to attach films to wafers. Therefore, various types of film attachers have also appeared. The film mounter sticks various blue films or UV films on the surface of the wafer to protect the wafer during production. [0003] At present, since there are many types of film laminating machines, and the types of films are also different, the same film laminating machine may not be suitable for every kind of film. For example, when the ATM-1000C film laminating machine is pasting the blue film of Mitsui Chemicals SB-085L-BN20-R2, it is very easy to break the film at the waste film end, although Countermeasures can be taken to adju...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCY02P90/02
Inventor 谭汉军黄仁禄曹志兵
Owner FOUNDER MICROELECTRONICS INT
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