A space-borne vertical combined electronic equipment chassis

Abstract

The invention provides a satellite-borne vertical combination electronic equipment chassis. The chassis comprises a bottom plate (1), a front panel (2), a rear panel (4) and modules (3); a plurality of equipment installation feet (5), a plurality of ribs (8) and a plurality of countersunk through holes (9 and 10) are arranged on the bottom plate (1); a screw passes through the countersunk through hole (9) and is connected with a threaded blind hole at the bottom of one module in the modules (3), such that a modular structure is fixed on the bottom plate (1); then, the lower edge of a circuit board in the modular structure is fixed on the rib (8) of the bottom plate (1); the next module in the modules (3) is assembled in sequence till all the modular structures are installed on the bottom plate (1); and finally, a long bolt sequentially passes through corresponding through holes on the front panel (2), the modules (3) and the rear panel (4) and is fastened by using a nut. A layer of thermal conducting filler is arranged between the module (3) and the installation contact surface of the bottom plate (1).

Description

technical field [0001] The application belongs to the design field of space-borne electronic equipment chassis, and mainly relates to a vertical combined electronic equipment chassis used for satellite payloads. Background technique [0002] Spaceborne electronic equipment is an important part of the satellite payload and plays an important role in the satellite system. Compared with ordinary ground electronic equipment, the special working environment of spaceborne electronic equipment puts forward special design requirements for it. On-board electronic equipment works in a vacuum environment, and the main heat dissipation methods are heat conduction and heat radiation. Such as figure 1 with figure 2 As shown, in the prior art, the on-board electronic equipment with multi-module structure usually adopts the form of a vertical combined case, the purpose is to ensure that the mounting surfaces of all the first modules 18 in the combined case can be directly contacted with...

AI Technical Summary

Problems solved by technology

But this will lead to another problem: since the installation surface of the vertical combination chassis is composed of the installation surface of each module, the flatness of the combined installation surface is difficult to meet the mandatory requirement of less than 0.1mm proposed by the satellite. This will lead to a slight gap between the mounting surface of some modules and the satellite platform, which will affect the heat dissipation of these modules

[0003] In order to ensure that the flatness of the installation surface of the vertical combined electronic equipment chassis meets the overall requirements of the satellite, there are usually two methods at present. One method is to repair the installation surface after the equipment is assembled and debugged. Grinding with files will not only damage the conductive oxide layer on the mounting surface and directly affect the electrical conductivity of the device, but also damage the surface roughness of the mounting surface and affect the heat dissipation performance. At present, this method is rarely used; One approach is to deliberately design the bottom of all the first modules 18 to be thickened outwards when designing the chassis, so that after all the first modules 18 are processed, they are assembled into a whole with long bolts, and finally installed The machine tool removes all the thickened parts of the first module 18 in order to meet the flatness requirements

However, the reality is that even if this is done, it is difficult to ensure that the flatness of the final delivered satellite equipment can meet the requirements

There are two reasons for this. First, the coordination and positioning between the various modules of the vertical combination chassis is realized through the sub-port, and the sub-port fit between any two modules is a gap fit, and the gap fit means that the gap between the modules The relative position between them is not completely fixed, and there is a small amount of activity space consistent with the gap, which directly leads to the fact that the relative position of the mounting surface of each module is not fixed after each assembly, so it is difficult to reassemble the chassis after it is disassembled Once again, ensure that the flatness meets the requirements; second, once the chassis is disassembled, a certain amount of stress will be released, resulting in local micro-deformation, coupled with the influence of the subsequent installation of circuit boards, components, etc. When the modules with components and circuit boards are combined together, it will be found that the flatness is difficult to meet the requirements, which will affect the heat dissipation of some modules

Generally speaking, at present, there is no good solution to the flatness problem of the mounting surface of the space-borne vertical combined electronic equipment chassis, and it is urgent to solve this problem through structural improvement and design

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