Molded package and its manufacturing method
A technology of molding packaging and manufacturing method, which is applied in the direction of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve the effect of suppressing leakage and preventing resin burrs
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no. 1 Embodiment approach
[0035] refer to figure 1 (a)~ image 3 (b) The molded package of the first embodiment of the present disclosure will be described. In addition, in figure 2 , omitting wiring 20, the image 3 In (a), the end portion 31 of the molded resin 30 is shown by a single-dot chain line, and in image 3 In (b), the molding resin 30 is omitted. This molded package is attached to vehicles such as automobiles, for example, and is used as various devices for driving the vehicles.
[0036]The molded package of the present embodiment includes: a substrate 10 whose one surface 11 and the other surface 12 are substantially in a front-to-back relationship; wirings 20 and 21 protruding from the one surface 11 of the substrate 10; One surface 11 of the substrate 10 and the wiring 20 are sealed. Here, in this embodiment, electronic components 40 , 41 are mounted on one surface 11 of the substrate 10 , and these electronic components 40 , 41 are also sealed with the molding resin 30 .
[003...
no. 2 Embodiment approach
[0073] For the molded package of the second embodiment of the present disclosure, refer to Figure 5 , the description will focus on the differences from the first embodiment described above.
[0074] Such as Figure 5 As shown, in this embodiment, on the outside of the molded resin 30, the portion farther away from the end 31 of the molded resin 30 than the second portion 52 in the resin film 50 becomes a portion farther from the end portion 31 of the molded resin 30 than the upper surface 52a of the second portion 52. More prominent protrusions 55 . The resin film 50 having such protrusions 55 can be formed, for example, by using the upper mold 101 having depressions corresponding to the protrusions 55 in a molding process.
[0075] According to the present embodiment, the protruding portion 55 functions as a dam against leakage of the molding resin 30 during the molding process. Specifically, even if the molding resin 30 leaks to the upper surface 52 a of the second port...
no. 3 Embodiment approach
[0077] refer to Figure 6 A mold package according to a third embodiment of the present disclosure will be described. Such as Figure 6 As shown, a conventional protective film P1 may be interposed between the first wiring 20 and the resin film 50 (refer to the above-mentioned Figure 7 (a), Figure 7 (b)). In addition, the structure in which this protective film P1 is interposed can also be applied to each of the above-mentioned embodiments, of course.
[0078] (other embodiments)
[0079] In addition, as the substrate 10 , a ceramic substrate made of ceramics such as alumina and silica may be used.
[0080] In addition, as a molded package, one side 11 of the substrate 10 and the wiring 20 on the one side 11 are sealed with a molded resin, and the wiring 20 is sealed with the molded resin 30 so that the end portion 31 of the molded resin 30 is sealed. structure. For example, not only the one surface 11 side of the substrate 10 but also the other surface 12 side of the...
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