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Method for producing cuprous oxide microparticles, cuprous oxide microparticles, and method for producing a conductive film

A cuprous oxide and manufacturing method technology, applied in the direction of copper oxide/copper hydroxide, printed circuit manufacturing, electrical components, etc., can solve the problems of residual, difficult to adjust impurities, etc.

Active Publication Date: 2017-05-17
NISSHIN ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a problem that the reducing agent is difficult to adjust and the reducing agent remains as an impurity of the cuprous oxide powder

Method used

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  • Method for producing cuprous oxide microparticles, cuprous oxide microparticles, and method for producing a conductive film
  • Method for producing cuprous oxide microparticles, cuprous oxide microparticles, and method for producing a conductive film
  • Method for producing cuprous oxide microparticles, cuprous oxide microparticles, and method for producing a conductive film

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Embodiment Construction

[0042] Hereinafter, the method for producing cuprous oxide fine particles, the method for producing cuprous oxide fine particles, and the conductor film of the present invention will be described in detail based on preferred embodiments shown in the drawings.

[0043] figure 1 A schematic diagram showing a fine particle production apparatus used in the production method of cuprous oxide fine particles according to the embodiment of the present invention.

[0044] figure 1 The microparticle production device 10 shown (hereinafter simply referred to as the production device 10) is used for producing cuprous oxide (Cu 2 O. Device for oxidizing first copper) microparticles.

[0045] Manufacturing device 10 has: plasma torch 12, in order to generate thermal plasma; Material supply device 14, in order to supply the manufacturing material (powder material) of cuprous oxide microparticles in plasma torch 12; Chamber 16, has Function as a cooling tank for generating the primary fi...

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Abstract

The method for producing cuprous oxide fine particles includes a step of generating cuprous oxide fine particles using copper compound powder and a thermal plasma flame. The hot plasma flame comes from an inert gas. The production step includes dispersing the powder of the copper compound using a carrier gas, supplying the powder of the copper compound to a thermal plasma flame, or dispersing the powder of the copper compound in water to form a slurry, and supplying the slurry into droplets. Steps in a hot plasma flame. Further, preferably, the generating step further has a step of supplying cooling gas to the terminal portion of the thermal plasma flame.

Description

technical field [0001] The present invention relates to cuprous oxide (Cu 2 O) A method for producing fine particles, a method for producing cuprous oxide fine particles, and a conductive film. In particular, antiseptics, bactericides, pesticides, catalysts, solar cells, and light-emitting devices that can be used in ship bottom paints (antifouling paints), electrodes for electronic components such as conductive paints, laminated ceramic capacitors, and printed circuits Wiring of substrates, wiring of touch panels, and methods of manufacturing cuprous oxide fine particles used in flexible electronic paper, etc., and methods of manufacturing cuprous oxide fine particles and conductive films. Background technique [0002] Currently, various fine particles are used for various purposes. Microparticles such as metal particles, oxide particles, nitride particles, carbide particles, etc. are used in: semiconductor substrates, printed circuit boards, electrical insulating materia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01G3/02
CPCC01G3/02C01P2002/72C01P2002/88C01P2004/64H05K1/097C01P2002/60H05K3/0091H05K2203/1105
Inventor 木下晶弘上村直仁
Owner NISSHIN ENG