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Method for producing soldered electrode and use thereof

A manufacturing method and electrode technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as difficulty in controlling the height of solder bumps and inability to freely select solder composition, so as to improve solder filling ability and prevent cracking Effect

Inactive Publication Date: 2018-01-02
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these methods, it is difficult to control the height of the solder bumps, and there are constraints such as the inability to freely select the solder composition.

Method used

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  • Method for producing soldered electrode and use thereof
  • Method for producing soldered electrode and use thereof
  • Method for producing soldered electrode and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0074] Hereinafter, the present invention will be further specifically described based on examples, but the present invention is not limited to these examples. In the description of the following Examples and the like, "part" is used in the meaning of "part by mass".

[0075] 1. Measuring method of physical properties

[0076] (Measuring method of weight average molecular weight (Mw) of alkali-soluble resin (A))

[0077] The weight average molecular weight (Mw) was measured by gel permeation chromatography under the following conditions.

[0078] Pipe string: TSK-M and TSK2500 of the pipe string manufactured by Tosoh Corporation are connected in series

[0079] Solvent: Tetrahydrofuran

[0080] ·Temperature: 40°C

[0081] Detection method: Refractive index method

[0082] ·Standard material: polystyrene

[0083] ・GPC device: manufactured by Tosoh, device name "HLC-8220-GPC"

[0084] 2. Preparation of resist-forming composition

Synthetic example 1

[0085] [Synthesis Example 1] Synthesis of Alkali-Soluble Resin 1

[0086] In a flask with a dry ice / methanol reflux device replaced with nitrogen, 5.0 g of 2,2′-azobisisobutyronitrile as a polymerization initiator, and 90 g of diethylene glycol ethyl as a polymerization solvent were added Methyl ether, stirred. Add 10 g of methacrylic acid, 15 g of p-isopropenylphenol, 25 g of methacrylic tricyclo [5.2.1.0 2 ,6 ]decyl ester, 20g of isobornyl acrylate, and 30g of n-butyl acrylate, start stirring, and heat up to 80°C. Then, it heated at 80 degreeC for 6 hours.

[0087] After heating, the reaction product was added dropwise to a large amount of cyclohexane to solidify. The solidified matter was washed with water, and the solidified matter was redissolved in tetrahydrofuran having the same mass as the solidified matter, and the obtained solution was added dropwise to a large amount of cyclohexane to solidify again. After the redissolving and coagulation operations were performe...

Synthetic example 2

[0088] [Synthesis Example 2] Synthesis of Alkali-Soluble Resin 2

[0089] In a flask with a dry ice / methanol reflux device replaced with nitrogen, 5.0 g of 2,2′-azobisisobutyronitrile as a polymerization initiator, and 90 g of diethylene glycol ethyl as a polymerization solvent were added Methyl ether, stirred. Add 10 g of methacrylic acid, 15 g of p-isopropenylphenol, 25 g of methacrylic tricyclo [5.2.1.0 2.6 ]decyl ester, 20g of tricyclo[5.2.1.0 2.6 ] decyl ester, and 30g of n-butyl acrylate, start stirring, and heat up to 80°C. Then, it heated at 80 degreeC for 6 hours.

[0090] After heating, the reaction product was added dropwise to a large amount of cyclohexane to solidify. The solidified matter was washed with water, and the solidified matter was redissolved in tetrahydrofuran having the same mass as the solidified matter, and the obtained solution was added dropwise to a large amount of cyclohexane to solidify again. After the redissolving and coagulation operati...

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Abstract

The present invention is a method for producing a soldered electrode comprising: a step (1) for forming a film of a light-sensitive resin composition on a substrate having an electrode pad; a step (2)for forming a resist having an opening in the region corresponding to the electrode pad by selectively exposing and developing the film; a step (3) for heating and / or exposing the resist to light; and a step (4) for filling molten solder into the opening while heating the solder. This method for producing a soldered electrode can prevent cracking at the resist surface even when the resist is exposed to high heat during solder filling, as with IMS, and can improve solder filling performance, and as result thereof, a soldered electrode that suits a required purpose can be accurately produced.

Description

technical field [0001] The present invention relates to a method for manufacturing a solder electrode, a solder electrode, a method for manufacturing a laminate, a laminate, and an electronic component. Background technique [0002] The injection molded solder (IMS) method is one of the methods for forming solder patterns such as solder bumps. Conventionally, as a method of forming a solder pattern on a substrate such as a wafer, a solder paste method, a plating method, or the like is used. However, in these methods, it is difficult to control the height of the solder bumps, and there are constraints such as the inability to freely select the solder composition. In contrast, the IMS method is known to have the advantage of not having these constraints. [0003] The IMS method, as shown in Patent Document 1 to Patent Document 4, is a method in which solder is poured into an opening of a resist pattern while bringing a nozzle capable of injection molding molten solder into c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60G03F7/40H05K3/34
CPCH01L24/11H01L24/13H01L24/16H01L24/81H01L2224/11H01L2224/1131H01L2224/11312H01L2224/11622H01L2224/13111H01L2224/16225H01L2224/81002H01L2224/81203H01L2924/01047H01L2924/01029G03F7/40H05K3/34H01L2224/1147H01L2224/11618
Inventor 武川纯高桥诚一郎长谷川公一楠本士朗
Owner JSR CORPORATIOON