A detection system for bga chips

Abstract

The invention discloses a BGA chip detection system, which comprises a workbench, a platen mechanism located above the horizontal workbench, and an automatic input positioning system; a fixed groove is provided on the horizontal workbench, and a probe module is arranged in the fixed groove; automatic input and positioning The system includes an input module, a support module and a limit module. The input module transports the BGA chip to the support module, and the retractable support module makes the BGA chip fall on the probe module in the fixed groove; the pressure plate is pressed down on the BGA chip, so that the solder joints are in contact with the probes on the probe module and Form a signal connection with the detection module; after the detection is completed, the pressure plate is reset; after that, the probe module is driven up by the probe module lifting mechanism to make the BGA chip break away from the fixing slot. In this way, the BGA chip can be automatically positioned in the fixing groove, and after the BGA chip is inspected, it can be automatically separated from the fixing groove, which is not only easy to operate, but also accurate in positioning of the BGA chip.

Description

Technical field: [0001] The invention relates to a detection system of a BGA chip. Background technique: [0002] Because the thickness of BGA-packaged chips (referred to as BGA chips) is more than 1 / 2 less than that of ordinary QFP, the weight is reduced by more than 3 / 4, and at the same time, it can improve the electrothermal performance, the parasitic parameters are small, the signal transmission delay is small, and it can adapt to a wide range of frequencies and can be assembled. Coplanar welding features high reliability, so it is widely used in high-density, high-performance, multi-pin integrated circuits such as CPU, motherboard south and north bridge chips, and portable mobile terminals that require high volume and quality, such as tablet computers and PADs Wait. [0003] Existing BGA chips are inspected after welding to avoid defective products caused by missing soldering and false soldering. At present, the BGA chip soldering inspection is mainly through manual h...

AI Technical Summary

Problems solved by technology

At present, the welding inspection of BGA chips is mainly through manual hand pressure operation. Since the BGA chips are plane soldered, when manual hand pressure inspection is performed, the flat BGA chips are prone to uneven force, so that some solder joints cannot be in contact with the probes. Affect the detection effect and efficiency

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