Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

sram storage unit, storage array and memory

A storage unit and storage array technology, which is applied in the field of SRAM storage unit, storage array and memory, can solve the problems of SRAM storage unit write operation failure, etc., achieve good write efficiency, increase reverse voltage, and improve write efficiency Effect

Active Publication Date: 2018-01-26
SPREADTRUM COMM (SHANGHAI) CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] The technical problem solved by the present invention is to provide a SRAM storage unit to solve the problem of write operation failure that may exist in the SRAM storage unit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • sram storage unit, storage array and memory
  • sram storage unit, storage array and memory
  • sram storage unit, storage array and memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0061] In order to make the purpose, features and effects of the present invention more obvious and understandable, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0062] Many specific details are set forth in the following description to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways than described here, so the present invention is not limited by the specific embodiments disclosed below.

[0063] Such as Figure 4 The shown SRAM storage unit includes: a first PMOS transistor ML0, a second PMOS transistor ML1, a first NMOS transistor MPD0, a second NMOS transistor MPD1, a first pass transistor MPG0, a second pass transistor MPG1, a first double-gate The PMOS transistor MDP0 and the second double-gate PMOS transistor MDP1, the first pass transistor MPG0 and the second pass transistor MPG1 are all NMOS transist...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an SRAM memory unit, a memory array and a memory. The SRAM storage unit includes: a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a first pass transistor, a second pass transistor, a first double-gate PMOS transistor, and a second double-gate PMOS transistor . The invention can solve the problem that the writing operation failure of the SRAM storage unit may exist.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an SRAM memory unit, a memory array and a memory. Background technique [0002] SRAM (Static Random Access Memory, hereinafter referred to as SRAM) has the advantages of high speed, low power consumption and compatibility with standard processes. It is widely used in PCs, personal communications, consumer electronics (smart cards, digital cameras, multimedia players) and other fields. [0003] The most common SRAM storage unit is 6T unit, such as figure 1 As shown, the SRAM storage unit includes: a first PMOS transistor ML0, a second PMOS transistor ML1, a first NMOS transistor MPD0, a second NMOS transistor MPD1, a third NMOS transistor MPG0 and a fourth NMOS transistor MPG1. [0004] The first PMOS transistor ML0 , the second PMOS transistor ML1 , the first NMOS transistor MPD0 and the second NMOS transistor MPD1 form a bistable circuit, and the bistable circuit forms ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/419
Inventor 王林
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products