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31results about How to "Optimize write performance" patented technology

Split gate flash memory and manufacture method thereof

The invention provides a split grating flash memory and a manufacture method thereof. The split gate flash memory comprises a semiconductor substrate, a gate oxide and split structure units, wherein the gate oxide is positioned on the surface of the semiconductor substrate; and the split structure units are positioned on the gate oxide. Each split structure unit is provided with a floating gate, a gate medium layer, a control gate, a first side wall layer, a second side wall layer, a third side wall layer, a word line and side walls, wherein the floating gate is positioned on the gate oxide, and the surface of the floating gate is in a cambered shape with an inclined angle; the gate medium layer is positioned on the surface of the floating gate; the control gate is positioned on the gate medium layer; the first side wall layer is positioned on the control gate; the second side wall layer is positioned on the inner side wall of the control gate; the third side wall layer is positioned in the first side wall, the second side wall layer, the gate medium layer and the inner side wall of the floating gate; the word line is positioned between two split structure units and fills a gap; and the side walls are positioned at the outside walls of the split structure units. The invention improves the performance of flash memory erasure or writing and the electric performance of the flash memory.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Split gate flash memory and manufacture method thereof

The invention provides a split grating flash memory and a manufacture method thereof. The split gate flash memory comprises a semiconductor substrate, a gate oxide and split structure units, wherein the gate oxide is positioned on the surface of the semiconductor substrate; and the split structure units are positioned on the gate oxide. Each split structure unit is provided with a floating gate, a gate medium layer, a control gate, a first side wall layer, a second side wall layer, a third side wall layer, a word line and side walls, wherein the floating gate is positioned on the gate oxide, and the surface of the floating gate is in a cambered shape with an inclined angle; the gate medium layer is positioned on the surface of the floating gate; the control gate is positioned on the gate medium layer; the first side wall layer is positioned on the control gate; the second side wall layer is positioned on the inner side wall of the control gate; the third side wall layer is positioned in the first side wall, the second side wall layer, the gate medium layer and the inner side wall of the floating gate; the word line is positioned between two split structure units and fills a gap; and the side walls are positioned at the outside walls of the split structure units. The invention improves the performance of flash memory erasure or writing and the electric performance of the flash memory.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Structure for optimizing writing performance of magnetic random access memory and preparation method thereof

The invention discloses a structure for optimizing the writing performance of a magnetic random access memory. The structure comprises a writing accelerator, the writing accelerator is positioned on the lower side of a bottom electrode of the magnetic random access memory and the upper side of a bottom electrode through hole, and the writing accelerator is directly connected with the bottom electrode and the bottom electrode through hole. The invention further discloses a preparation method of the structure for optimizing the writing performance of the magnetic random access memory. The preparation method comprises the following steps: 1, providing a CMOS substrate with a polished surface and a metal connecting line Mx; 2, manufacturing a bottom electrode through hole in the flattened CMOSsubstrate, and grinding the bottom electrode through hole; 3, on the bottom electrode through hole, performing graphical definition and etching to manufacture writing accelerator metal, filling a writing accelerator dielectric medium, and grinding the writing accelerator dielectric medium by adopting chemical mechanical planarization; and 4, sequentially depositing a bottom electrode, a magnetictunnel junction multilayer film and a top electrode on the writing accelerator, manufacturing a magnetic tunnel junction storage unit, and finally manufacturing bit line connection on the top electrode.
Owner:SHANGHAI CIYU INFORMATION TECH
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