Cassette positioning device and semiconductor processing equipment

A technology for positioning devices and cassettes, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as reduced transmission and process efficiency, wafer 6 offset, and manipulators cannot normally pick up wafers, etc., to avoid wafer position Offset or drop, ensure normal film pickup, improve transmission and process efficiency

Active Publication Date: 2016-02-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Because in the process of carrying the film cassette 1, the film cassette 1 will inevitably tilt and vibrate, which makes the wafer 6 easily shift outwards from the opening of the cassette 1, or ev

Method used

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  • Cassette positioning device and semiconductor processing equipment
  • Cassette positioning device and semiconductor processing equipment
  • Cassette positioning device and semiconductor processing equipment

Examples

Experimental program
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Example

[0034] First embodiment

[0035] Please refer to Figure 3A-Figure 4D The film box is composed of a top plate 21, a bottom plate 22, a side frame 23 and a rear pillar 24. An open frame structure with an opening (located on the side opposite to the rear pillar 24) on one side, and the inner surface of these parts is correspondingly provided with edge Multiple notches are arranged at intervals in the vertical direction to support the wafer.

[0036] The cassette positioning device includes a limit door 31 and a positioning mechanism. Among them, there are two limit doors 31, and they are rotatably connected to the two side frames 23 respectively. By rotating the two limit gates 31 synchronously, both of them can be located at the first position where the wafer in the cassette is blocked, or at the second position where the wafer in the non-blocking cassette is moved. The so-called second position of the wafer in the non-blocking cassette means that when the limit door 31 is at the ...

Example

[0046] Second embodiment

[0047] Compared with the above-mentioned first embodiment, the cassette positioning device provided by the embodiment of the present invention also includes a limit door 31 and a positioning mechanism, and the positioning mechanism also includes an arc-shaped guide rail, a sliding member, and a locking member. The function is the same as that of the above-mentioned first embodiment, and the structure of the arc-shaped guide rail is the same as that of the above-mentioned first embodiment, but the structure of the sliding member and the locking member is different from the above-mentioned first embodiment. Only the differences between this embodiment and the above-mentioned first embodiment will be described in detail below.

[0048] Please refer to Figure 5A-Figure 6B In this embodiment, two first protrusions 214 facing each other are also provided at the middle positions of the respective hole walls of the first positioning hole 212 and the second posi...

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Abstract

The invention provides a cassette positioning device and semiconductor processing equipment. The cassette positioning device comprises limiting doors and a positioning mechanism, wherein the limiting doors are rotatablely connected with side frames of the cassette, and through rotating the limiting doors, the limiting doors are located at a first position or a second position stopping or not stopping wafers in the cassette from moving; and the positioning mechanism is used for locking the limiting doors at the first position or the second position and unlocking the limiting doors when wafers need to be taken or placed. According to the cassette positioning device provided by the invention, the limiting doors can be opened or closed at any time according to particular needs, the wafers can be stopped from moving in relative to the cassette, offset or fall of the wafers can be avoided, and a manipulator can be ensured to take wafers normally.

Description

technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a chip box positioning device and semiconductor processing equipment. Background technique [0002] Removing wafers from cassettes is the first step in the automatic transfer process of many semiconductor processing equipment, so the efficiency and reliability of wafer removal has become one of the important prerequisites for highly automated wafer production. [0003] figure 1 Schematic block diagram of semiconductor processing equipment. Such as figure 1 As shown, the semiconductor processing equipment includes a loading chamber 13 , a transfer chamber 2 and a reaction chamber 3 . Wherein, the loading chamber 13 is used to carry the cassette 1 with a plurality of wafers placed therein; a manipulator 4 is arranged in the transfer chamber 2 for taking out or putting in the wafer 6 from the cassette 1 in the loading chamber 13, And moving the wafer 6 into or...

Claims

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Application Information

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IPC IPC(8): H01L21/673H01L21/68
Inventor 余志龙贾强李冬冬
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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