Temperature testing box used for high-reliability electronic element
A technology for electronic components and temperature testing, used in environmental/reliability testing, instruments, measuring electricity, etc., can solve the problems of large samples, temperature spatial inhomogeneity, easily affected by surrounding samples, etc., to improve spatial uniformity , Improve stability and reduce the effect of environmental temperature fluctuations
Active Publication Date: 2016-03-30
BEIJING SHENGTAOPING TEST ENG TECH RES INST
View PDF9 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0008] The object of the present invention is to provide a high-reliability temperature test chamber for electronic components, aiming at the shortcomings of the existing high-temperature test chambers for high-temperature aging and life testing of components, and can solve the uneven temperature space caused by the chaos of the air flow field The problem of high stability and the sample is easily affected by the surrounding samples, slowing down the influence of the external ambient temperature fluctuation of the test chamber on the internal temperature of the test chamber
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the Some, but not all, embodiments are invented. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0016] see figure 2 , this embodiment discloses a temperature test chamber for high reliability electronic components, including a fan and a heater, and also includes:
[0017] A hollow pipe 1 as a PCB test board bracket with electronic components installed; wherein, the PCB test board is placed in the hollow pipe 1, and the pipe wall of the hollow pipe 1 is provided ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a temperature testing box used for a high-reliability electronic element. By adopting the temperature testing box provided by the invention, the defects of the high temperature testing box used for the high temperature aging and the service lifetime test of the elements can be overcome, and the problems such as the large non-uniformity of the spatial temperature caused by the air flow field chaos and the samples easy to be influenced by the peripheral samples can be solved, and then the influence of the outside ambient temperature fluctuation of the testing box on the internal temperature of the testing box can be relieved. The temperature testing box comprises a blower fan and a heating device. A hollow pipeline used as a PCB testing board bracket is also included, and a PCB testing board is disposed in the hollow pipeline. The wall of the hollow pipeline is provided with a plurality of air inlet holes, and the blower fan can be used to blow the air heated by the heating device into the hollow pipeline through the air inlet holes. The bottom surface and the upper surface of the PCB testing board can be used to form an air layer constituted by the uniformly parallely flowing air, and the air in the air layer can flow to the heating device through an air isolation layer formed between the hollow pipeline and the inner wall of the testing box, and then can be heated by the heating device.
Description
technical field [0001] The invention relates to the technical field of high-temperature test chambers, in particular to a temperature test chamber for high-reliability electronic components. Background technique [0002] High-temperature aging or high-temperature life tests are usually mandatory tests for high-reliability electronic components in screening, identification, and quality consistency testing. High-temperature aging or high-temperature life test requires the use of a high-temperature test chamber to apply temperature stress to the tested components. The tested components are usually installed on the PCB (printed circuit board) test circuit board and placed in a high-temperature box. At the same time, the tested components are subjected to electrical stress such as voltage, current, frequency, etc., and the electrical parameters of the components are tested if necessary. monitor. The tested components work at high temperature, which accelerates the aging of comp...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): G01R31/00
CPCG01R31/003
Inventor 王群勇
Owner BEIJING SHENGTAOPING TEST ENG TECH RES INST