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Light emitting diode (LED) encapsulating device

A LED chip and potting technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as inappropriateness, and achieve the effects of reducing production costs, simple process, and strong technical operability

Active Publication Date: 2016-03-30
合肥新观点照明科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is not suitable for LED devices with integrated lens structure. In order to make it easy to complete through the simple process of dieless dispensing, there is an urgent need for a new structure of LED devices.

Method used

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  • Light emitting diode (LED) encapsulating device

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with the accompanying drawings.

[0012] An LED potting device, comprising a substrate, an LED chip mounted on the substrate, and a lens wrapped outside the LED chip, the lens comprising a base layer wrapped outside the LED chip and a stacked layer covering the base layer, The surface of the substrate is provided with an annular groove along its edge, and the groove is provided with an outwardly extending liquid drainage groove, and a liquid discharge port of the liquid drainage groove protrudes from the side wall of the substrate. The stacked layer is composed of multiple layers of encapsulation glue.

[0013] The potting steps of the LED potting device of the present invention are as follows:

[0014] Put the LED chip on the substrate first, then do the first dispensing on top of the LED chip, and then cool to room temperature to solidify to form a base layer. The dispensing amount of the first disp...

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Abstract

The invention relates to a light emitting diode (LED) encapsulating device. The LED encapsulating device comprises a base plate, an LED chip and a lens, wherein the LED chip is arranged on the base plate, the lens wraps the LED chip and comprises a basic layer and a stack layer, the basic layer wraps the LED chip, the stack layer covers the basic layer, a first annular groove and a second annular groove are respectively arranged on the base plate and at outer edges of the basic layer and the stack layer and communicated with each other via a liquid discharge groove, and a liquid discharge hole of the liquid discharge groove extends from the side wall of the base plate. With the LED encapsulating device, wafer level package of an LED can be achieved in no need of a die, the technological operability is high, the process is simple, and the production cost of the LED also can be reduced.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to an LED encapsulation device. Background technique [0002] Due to the advantages of power saving, long life and small size, LED lamps have been increasingly used in lighting, backlighting and other fields, and are expected to replace traditional light sources such as incandescent lamps and fluorescent lamps. The traditional packaging process of LED devices is a device-level process, which has high cost and is difficult to perform high-density packaging. The lenses of the existing LED devices basically adopt an integrated structure of one-time molding. Most of the traditional lens packages use prefabricated lenses or mold molding methods, which are not suitable for wafer-level packaging. [0003] Based on this, people hope to use the moldless dispensing process to package the lens of the wafer-level LED chip. The simplest and intuitive method of moldless dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/56
CPCH01L33/483H01L33/52H01L33/56
Inventor 高伟冯世
Owner 合肥新观点照明科技股份有限公司
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