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Breaking apparatus

A breaking and loading technology, applied in glass cutting devices, fine working devices, glass manufacturing equipment, etc., can solve the problems of inability to break with high precision, general products without suitable structure, and inconvenience

Active Publication Date: 2016-05-11
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the occurrence of the above-mentioned positional shift or floating, there is a problem that breaking can not be performed with high precision
[0005] This shows that the above-mentioned existing breaking device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

Method used

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Embodiment Construction

[0042] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of a breaking device proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Efficacy, detailed as follows.

[0043]

[0044] figure 1 It is a perspective view of main parts of the breaking device 100 according to this embodiment, especially the main parts related to supporting the object W to be broken. again, figure 2 is through figure 1 An enlarged perspective view of the cross-section of the A-A' part of . image 3 It is a schematic cross-sectional view including main components of the breaking device 100 .

[0045] The fracturing device 100 of this embodiment is, in general, a device as follows: on the upper surface of the stage 1, the object W to be cleaved, which is in a p...

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Abstract

The invention relates to a breaking apparatus, and the breaking apparatus is used for inhibiting offset or floating of a position during breaking. The device consists of the following parts: a carrying part which is rectangular when being viewed from the top, and is used for carrying a plurality of broken objects which are arranged at a plurality of breaking preset positions in parallel at equal intervals; position offset limiting parts which are arranged to be corresponding to four sides of the carrying part in an independent manner. All position offset limiting parts are respectively located in a horizontal plane, and enable a plurality of unit tooth parts enabling side end parts extending towards the carrying part to be separated from the plurality of preset breaking positions at equal intervals. Moreover, the adjacent unit gear parts are configured in a manner that the distances from the unit gear parts to one preset breaking position are equal. All position offset limiting parts are configured at position offset limiting positions during the separation of the broken objects on the carrying part at least during breaking start.

Description

technical field [0001] The present invention relates to devices for fracturing substrates of brittle materials, and more particularly to their construction. Background technique [0002] A brittle material substrate (such as a glass substrate or a ceramic substrate, etc.) or a thin film layer or A device for breaking (fracturing) an object to be broken such as a rear film layer along the scribe line is known (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-195040 [0004] When using the breaking device disclosed in Patent Document 1, and sequentially breaking along each scribed line of a brittle material substrate formed with a plurality of scribed lines parallel to each other, there is a possibility that the broken substrate may be slightly damaged. There is a case of positional deviation. The positional shift is likely to occur especially when the vicinity of the end of the substrate is broken, and in this case, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/00B28D5/00C03B33/033C03B33/02
Inventor 岩坪佑磨太田欣也
Owner MITSUBOSHI DIAMOND IND CO LTD