Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Soft and rigid combination plate and mobile terminal

A technology of flexible and rigid boards and main boards, which is applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve the problems of insufficient wiring space of flexible circuit boards, and achieve the effect of meeting wiring requirements and increasing wiring space

Active Publication Date: 2016-05-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when more electronic components need to be arranged on the flexible circuit board, it is often difficult to meet the requirements due to the insufficient wiring space of the flexible circuit board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soft and rigid combination plate and mobile terminal
  • Soft and rigid combination plate and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] For ease of description, spatially relative terms such as "under", "beneath", "below", "above", "on" and other spatially relative terms may be used herein to describe an element as shown in the drawings Or the relationship of a feature to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a soft and rigid combination plate and a mobile terminal. The soft and rigid combination plate comprises a first flexible substrate layer, a first copper foil layer, a rigid layer and a second copper foil layer, wherein the first copper foil layer is laminated on the first flexible substrate layer; the first copper foil layer comprises a reinforcing region and a connection region which is separated from the reinforcing region; the ridged layer covers the reinforcing region; the second copper foil layer is laminated on the connection region; and the second copper foil layer extends along the direction far away from the rigid layer. According to the soft and rigid combination plate and the mobile terminal, provided by the invention, the first copper foil layer comprises the reinforcing region and the connection region, and the reinforcing region and the connection region are connected with the rigid layer and the second copper foil layer respectively. With the adoption of the manner, the second copper foil layer is laminated on the connection region of the first copper foil layer, so that the first copper foil layer and the second copper foil layer can be subjected to wire arrangement, and furthermore, a wire arrangement space of a soft plate part of the soft and rigid combination plate can be increased and wire arrangement requirements on different electronic components by the soft and rigid combination plate are met.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a rigid-flex board and a mobile terminal. Background technique [0002] Rigid-flex board is a circuit board with the characteristics of flexible circuit board and rigid circuit board formed by combining flexible circuit board and rigid circuit board according to relevant process requirements through pressing and other processes. [0003] At present, when producing soft and hard boards, it is usually necessary to configure the boards and equipment for the production of rigid circuit boards and flexible circuit boards at the same time, and then after the flexible circuit boards and rigid circuit boards are produced separately, machines such as pressing machines or laminating machines are used. Press together. [0004] However, with the above method, the number of layers used by the flexible circuit board and the rigid circuit board must be the same, so as to ensure the circ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/147H05K3/361H05K2201/2009H05K2201/2018
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com