The invention discloses a forming process for a fine line circuit with line width being below 0.05mm of a flexible printed circuit board, aiming to manufacture an IC (Integrated Circuit) package flexible substrate which has a copper-coated base material with the width being below 40 mu m and is 0.05mm in line width. The forming process for the fine line circuit with the line width being below 0.05mm of the flexible printed circuit board comprises the following steps of: material selecting, laser-based blind hole drilling, hole blacking, wet-process dry film attaching, exposure for development, blind hole electroplating, film removing and cleaning, secondary wet-process dry film attaching, secondary exposure for development, and circuit etching. Compared with the prior art, the IC package flexible substrate, which has the copper-coated base material with the width being below 40 mu m, is 0.05mm in line width and is manufactured through the steps of material selecting, laser-based blind hole drilling, hole blacking, wet-process dry film attaching, exposure for development, blind hole electroplating, film removing and cleaning, secondary wet-process dry film attaching, secondary exposure for development and circuit etching, fully meet a wiring requirement of the IC package flexible substrate, and is simple in process, low in cost, high in qualification rate and suitable for industrialized production.