Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for laying circuit board line

A circuit board circuit and circuit technology, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as errors in the calculation process, complicated and unreasonable operation procedures, etc.

Inactive Publication Date: 2008-06-18
INVENTEC CORP
View PDF0 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the aforementioned prior art, because the calculation process is completed manually by wiring engineers, its biggest defect is that the stability is relatively poor, and it is unavoidable that it will be affected by many factors, including the physiological and psychological factors of the operators themselves and the external environment. The influence causes errors in the calculation process. For example, when comparing the line spacing between signal lines with different line attributes in two signal lines, it is easy for wiring engineers to confuse the correspondence required for comparison due to negligence, resulting in the calculated results. for wrong
In addition, after the comparison is completed, it is still necessary to manually calculate the line width of the ground wire to be laid according to the larger one of the selected comparison data, and human calculation errors cannot be avoided.
On the other hand, the operation process is complicated, and the time-consuming and high cost of too many human resources is obviously extremely unreasonable for manufacturers who are eager to reduce production costs and increase product competitiveness.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for laying circuit board line
  • Method for laying circuit board line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0023] refer to figure 1 , which is a schematic flowchart of the method for laying circuit board circuits of the present invention. A data processing device assists the wiring application program to lay a ground line between two signal lines with different line attributes on a circuit board with multiple wiring layers, wherein the signal line and the ground line have corresponding A routing parameter, the routing parameter at least includes ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for laying out circuit board line. A data processing device assists a routing application program to carry out linear distance calculation and ground wire layout. The method comprises the steps: the linear distances between two signal lines with different line characteristics are respectively read from the corresponding routing parameters of the two signal lines and compared, and the larger linear distance is chosen as the linear distance of the two signal lines; at the same time, the line width of the ground wire to be laid out is calculated according to calculation rules; the line width calculated is compared with the line width regulated in the routing parameters of the line characteristics of the ground, if the comparison result is not in accordance, the line width regulated in the routing parameters of the line characteristics of the ground is corrected into the line width calculated to have the routing application program lay out the ground wire between the two signal lines according to the corrected ground wire width, thereby improving the correctness of the calculation and working efficiency, simplifying operation process and saving operation time.

Description

technical field [0001] The present invention relates to a method for laying circuit board lines, and more particularly, relates to a method for calculating the line distance and laying ground lines of a wiring application program assisted by a data processing device. Background technique [0002] At present, in the layout design of the circuit board, due to the consideration of the electrical signal transmission performance and anti-electromagnetic interference and other quality factors of the signal line (trace) laid out, the line width of the signal line, the same line attribute ( Net Type) signal lines and the line spacing between signal lines with different line attributes have certain restrictions. Take a signal line laid on an eight-layer circuit board as an example, its line attribute is LAN_D_4-6-20_4-8.5-20_3.5-7-20$L3&, where 4-6-20 indicates the signal whose line attribute is LAN_D The signal line width of the top layer (TOP layer) and the bottom layer (BOT layer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 张洁萍杨淑敏
Owner INVENTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products