Ultra-miniature multilayer chip balun

Abstract

The invention discloses an ultra-miniature multilayer chip balun, wherein an internal circuit layer comprises first to seventh circuit layers; the first circuit layer comprises four mutually insulated conductive metal sheets which are electrically connected with a bonding pad respectively; the second circuit layer comprises two mutually insulated flaky metal sheets; the third circuit layer comprises two mutually insulated flaky metal sheets; the flaky metal sheets in the second layer are arranged corresponding to the insulated metal sheets in the third layer so as to form two capacitors; the flaky metal sheets in the second layer and the flaky metal sheets in the third layer are electrically connected with the bonding pad respectively through a conducting post; the fourth to seventh circuit layers comprise two mutually insulated dual rectangular-shaped metal sheets respectively; the metal sheets in the fourth to seventh layers are connected end to end respectively in sequence through the conducting post to form two inductors; ends of the dual rectangular-shaped metal sheets in two inductors are electrically connected with the bonding pad respectively.

Description

technical field [0001] The invention discloses an ultra-miniature laminated chip balun, in particular, it can be used in the circuit system of LTE-4G communication mobile equipment. Background technique [0002] With the rapid development of mobile communication technology, 4G-LTE has appeared, which has increased many frequency bands while being convenient to use. There are more and more radio frequency components used in 4G-LTE mobile terminals, which put forward higher and higher requirements for transmission speed and reliability. The more commonly used method at present is to meet these requirements by configuring corresponding RF front-end and front-end matching modules in these devices. Balun and bandpass filter are currently the technical means commonly used by those skilled in the art. Balun is a passive component that can convert the balanced end signal and the unbalanced end signal. It has been obtained in various radio frequency circuits such as RFIC. widely us...

AI Technical Summary

Problems solved by technology

[0003] For the above-mentioned 4G mobile terminals in the prior art, a balun is needed to ensure the transmission speed and reliability. The balun of the traditional technology is a discrete component overlapping, which has the disadvantages of large volume and high energy consumption. The present invention provides A new ultra-miniature laminated chip balun structure, which realizes the balun in an ultra-miniature laminated structure, and then uses low-temperature co-fired ceramic technology to fire it

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