38 results about "Copper pour" patented technology

The invention relates to a manufacturing method of a flexible circuit board, comprising the following steps: providing a reinforcing plate and a copper pour base material, and the reinforcing plate comprises a base material layer and an adhesive layer arranged on the surface of the base material layer; the copper pour base material comprises an insulating layer and a conducting layer arranged on the surface of the insulating layer. The manufacturing method in the invention comprises the following steps: adhering the copper pour base material to the reinforcing plate and leading the conductinglayer to be exposed; forming a conducting circuit in the conducting layer to manufacture a circuit board; separating the reinforcing plate from the circuit board. The method can avoid the copper pourbase material from buckling and improve the manufacturing precision of the circuit board.

The invention relates to a copper pour substrate and a flexible circuit board using the copper pour substrate. The copper pour substrate comprises an insulating substrate, and a rolled copper foil and an electrolytic copper foil which are positioned at both opposite sides of the insulating substrate respectively. The flexible circuit board comprises the insulating substrate, and a conductive circuit and edge connectors which are arranged at both opposite sides of the insulating substrate respectively. The conductive circuit is made of rolled copper foils, and the edge connectors is made of electrolytic copper foils. The invention has the advantages of low cost, good mechanical properties, convenience for multi-board interconnection, and wide application in manufacturing field of flexible printed circuit boards.

An in-ear BLUETOOTH® headset antenna for single-ear and double-ear BLUETOOTH® headset. The antenna includes a radiation unit and a ground unit, both utilizing components that make up the headset. The radiation unit is composed of a horn of the BLUETOOTH® headset and a conductive foil attached to the horn surface. One end of the conductive foil is attached to the surface of the headset horn and the other end is connected to the feed point of the RF circuit antenna of the BLUETOOTH® headset. The ground unit includes copper pouring on a main printed circuit board connected to copper pouring a key printed circuit board by a cable. No additional antennas are required, and the in-ear BLUETOOTH® headset antenna reduces costs, saves space, and improves the radiation efficiency of the antenna due to the increased effective radiation area of the antenna.

The invention discloses a copper pour use aluminum nitride substrate pretreatment method which is a key process in the preparation process of an aluminum nitride DBC (direct bond copper) plate, and the method comprises the following steps: 1, aluminum nitride substrate surface cleaning; 2, aluminum nitride substrate activation for exposure of a new high-activity surface of the aluminum nitride by use of an alkali lye; 3, preparation of an aluminum nitride substrate surface transition layer which is a composite layer containing copper, manganese, calcium, aluminum and other ions; and 4, thermal oxidation treatment of the aluminum nitride substrate surface to form a composite modified layer. The copper pour use aluminum nitride substrate pretreatment method reduces the harsh conditions of aluminum nitride surface pretreatment in the aluminum nitride DBC process; the prepared aluminum nitride transition layer is a composite oxide layer, can smoothly and fully wet copper oxide on the surface of an oxygen-free copper sheet and spread at high temperature, and reacts to bond, adhesion strength of the aluminum nitride and the copper sheet is high, the hole rate is low, and the product anti temperature cycle performance is good.

The invention relates to a method for producing high-conductivity oxygen-free copper and a smelting device. According to the method, high-purity electrolytic copper blocks are washed cleanly, dried and fed into a graphite crucible, and is vacuumized, and a main heater is started to smelt the copper blocks into a copper liquid; a graphite mixer suspended in the graphite crucible is started to make up-down reciprocating movement and mixing in the graphite crucible to obtain liquid oxygen-free copper, and the liquid oxygen-free copper is poured in an ingot puller for crystallization and ingot pulling to obtain oxygen-free copper ingots. The smelting device comprises a vacuum smelting furnace body, the main heater and the graphite crucible which is arranged in a receiving cavity of the furnace body, wherein the bottom of the graphite crucible is provided with a liquid discharge port and a liquid discharge control valve. The smelting device is characterized in that the graphite mixer capable of lifting is suspended in the graphite crucible. The method and the smelting device have the advantages that the use of the graphite mixer for mixing increases the contact area between oxygen gas and graphite in copper liquid, and high-efficiency oxygen removal is achieved; and the requirements for the raw materials are not strict, the production cost is low, and the conductivity of the oxygen-free copper produced meets the requirements of high-class conducting wires.

The invention provides a manufacturing method for a copper pillar of a PCB. The manufacturing method comprises the steps that a first copper foil layer is formed on the first surface of a carrier; the first copper foil layer is etched to form a first copper pillar, and a part of the first surface is exposed; an anti-adhesion material layer is formed on the exposed part of the first surface, and the first copper pillar is exposed; a dielectric layer is formed on the anti-adhesion material layer and the first copper pillar; a hole is formed in the position, corresponding to the first copper pillar, of the dielectric layer, and the first copper pillar is exposed; a second copper pillar connected with the first copper pillar is formed in the position where the hole is formed, and a first copper layer connected with the second copper pillar is formed on the dielectric layer; the carrier and the anti-adhesion material layer are removed; then copper plating is conducted, and an outer-layer circuit is manufactured, so that the PCB is manufactured. The invention further provides the PCB with the protruding copper pillar manufactured based on the method. The protruding copper pillar manufactured based on the method has higher reliability during welding.

The invention relates to the technical field of a mobile terminal and discloses an antenna and on-off key integrated FPC (flexible circuit board) and the mobile terminal. The FPC comprises a copper pouring region, an antenna energy feed point, an on-off key energy feed point, a grounding bonding pad and an on-off key spring sheet. The FPC of the on-off key is used; the antenna energy feed point and a main body are arranged on the FPC, wherein the antenna energy feed point, the copper pouring region and the grounding bonding pad are connected to form the main body of the antenna, equivalently, the FPC of the on-off key is transformed into the antenna; the on-off key energy feed point is also electrically connected with the on-off key spring sheet, so that the functions of the on-off key are maintained on the FPC; and the antenna and on-off key integrated FPC has the advantages that the antenna and the on-off key of power source share the FPC, so that a conventional BT / WIFI (British Telecom / Wireless Fidelity) antenna can be saved, the cost of the antenna is reduced, the antenna and on-off key integrated FPC is easy to realize and is suitable for mass production, and an ultra-thin mobile phone is prevented from limiting the antenna region to influence the normal working of the antenna.

The invention relates to the technical field of mold production in the metallurgical industry, in particular to a composite copper anode mold with improved service life, which includes a mold body on which a copper pouring cavity is opened, and the mold body is located on the upper part of the copper pouring cavity and is provided with a mold lifter The top mold hole, the mold body is located in the copper pouring cavity and is compounded with a layer of chromium-zirconium-copper alloy. The chemical composition weight percentage of the chromium-zirconium-copper alloy is: Cr:0.75-0.85, Zr:0.15-0.25, Mn< 0.0013, Mo<0.0003, Ni<0.0005, Fe<0.037, and the balance is Cu; the service life of the copper anode mold of the present invention is greatly extended, and the average copper pouring amount can reach more than 1000 tons / block.

A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Disclosed is a dual-frequency, broadband, circularly polarized patch antenna, comprising a dielectric plate and a copper pour metal ground. Four dual-frequency monopole radiation patches and a feed network are provided on the dielectric plate. The four dual-frequency monopole radiation patches are sequentially connected to four ports of the feed network. The feed network comprises a coaxial connector, a first dual-frequency coupler, and a second dual-frequency coupler. A signal line of the coaxial connector is connected to an input end of the first dual-frequency coupler. A ground wire of the coaxial connector is connected to an input end of the second dual-frequency coupler. A straight-through end of the first dual-frequency coupler is connected to a first port. A coupling end of the first dual-frequency coupler is connected to a second port. An isolation end of the first dual-frequency coupler is connected to a first resistor. A straight-through end of the second dual-frequency coupler is connected to a fourth port. A coupling end of the second dual-frequency coupler is connected to a third port. An isolation end of the second dual-frequency coupler is connected to a second resistor. According to the present invention, by means of a reasonable layout of a feed network, miniaturization of a circularly polarized antenna and the dual-frequency characteristic or broadband characteristic thereof are achieved.