38 results about "Copper pour" patented technology

A production method of a semi-flexible printed circuit board comprises the following steps of: (1) preparing a sheet metal; (2) dividing the sheet metal into a molding area and a shaping area; (3) dividing the molding area into a plate area and a flexible area in advance in the molding area; (4) processing the sheet medal as follows: (4.1) processing of the pattern of the sheet metal and (4.2) processing the flexible bent area of the sheet metal so that the flexible area becomes thinner and can be bent; and (5) removing the shaping area and getting the semi-flexible printed circuit board. The invention adopts cheap general rigid materials such as glass fabric-epoxide resin copper pour foil, and the like to replace expensive flexible copper pour plate materials such as polyimide, and the like, thereby greatly reducing the cost. At the same time, the invention has the advantages of simple machinery process, high rate of finished products and high reliability. The semi-flexible printed circuit board produced by the method particularly suits vehicle-borne products with higher reliability requirement.

The invention relates to methods for preparing a continuous casting crystallizer copper plate surface modified W-Cu alloy layer and the application thereof, and the W-Cu alloy layer is especially applicable to a steel and nonferrous metal continuous casting crystallizer copper plate modified layer. The modified layer comprises the components by weight percent: 30.0-70.0% of W, 23.0-69.65% of Cu, 0.1-2.0% of Ni, 0.05-2.0% of Ag and 0.2-3.0% of Co. The preparation methods comprise a. hot pressed sintering and b. infiltration method, wherein the hot pressed sintering is characterized by (1) evenly mixing the powder and hot pressed sintering for molding; (2) pouring molten copper on sintered W-Cu alloy or placing a copper plate on the W-Cu alloy, heating and leading copper to be molten and have infiltration together with the W-Cu alloy, and cooling and then obtaining the copper plate product provided with the W-Cu alloy modified layer; and the infiltration method is characterized by (1) evenly mixing the powder, cold pressing into infiltration framework and high temperature sintering; (2) pouring the molten copper on the W-Cu framework for infiltration or placing the copper plate on the W-Cu alloy framework, heating and leading copper to be molten and have infiltration together with the W-Cu alloy framework, and then cooling. The W-Cu alloy layer has the advantages of greatly improving the production efficiency of a crystallizer, solving the problem of electroplating pollution of the crystallizer copper plate and being a high-efficiency and environment-friendly crystallizer surface modification method.

The invention relates to the field of building structure detection, in particular to a wall body detecting instrument. The multifunctional wall body detecting instrument includes five parts: a first part is a water pipe detection circuit, and the water pipe detection circuit is composed of a capacitive sensor used for detecting a water pipe, a monostable trigger circuit and a mean value circuit which are connected with one another in series sequentially; a second part is an electric wire detection circuit, and the electric wire detection circuit is composed of copper pour, a high-impedance amplifying circuit, an impedance conversion circuit which are connected with one another in series sequentially; a third part is a metal detection circuit, and the metal detection circuit is composed of an emission winding, a current syntonic circuit, a difference receiving coil, an amplifying circuit, a filter circuit and a biasing circuit which are connected with one another in series sequentially; a fourth part is an auxiliary circuit, and the auxiliary circuit is composed of an infrared transmitter and an infrared receiver which are connected with each other in series sequentially; and a fifth part is a control circuit which comprises a controller. The first part, the second part, the third part, the fourth part are connected with the fifth part respectively and independently. The multifunctional wall body detection is compact in size, low in manufacture cost, simple in craftsmanship, and good in manufacture repeatability.

The invention relates to a method for producing high-conductivity oxygen-free copper and a smelting device. According to the method, high-purity electrolytic copper blocks are washed cleanly, dried and fed into a graphite crucible, and is vacuumized, and a main heater is started to smelt the copper blocks into a copper liquid; a graphite mixer suspended in the graphite crucible is started to make up-down reciprocating movement and mixing in the graphite crucible to obtain liquid oxygen-free copper, and the liquid oxygen-free copper is poured in an ingot puller for crystallization and ingot pulling to obtain oxygen-free copper ingots. The smelting device comprises a vacuum smelting furnace body, the main heater and the graphite crucible which is arranged in a receiving cavity of the furnace body, wherein the bottom of the graphite crucible is provided with a liquid discharge port and a liquid discharge control valve. The smelting device is characterized in that the graphite mixer capable of lifting is suspended in the graphite crucible. The method and the smelting device have the advantages that the use of the graphite mixer for mixing increases the contact area between oxygen gas and graphite in copper liquid, and high-efficiency oxygen removal is achieved; and the requirements for the raw materials are not strict, the production cost is low, and the conductivity of the oxygen-free copper produced meets the requirements of high-class conducting wires.

A manufacture method for a subsided high-density mutual connection board includes steps of manufacturing an inner layer soft board; manufacturing conducting copper posts in conduction with an outer layer rigid board by utilizing an addition process on the upper side and the lower side of the inner layer soft board or on one side of the inner layer soft board and performing electroplating on the conducting copper posts; filling an insulation bonding layer bonded with the outer layer rigid board on the upper side and the lower side of the inner layer soft board or on the same side of the inner layer soft board and grinding the surface of the insulation bonding layer so as to expose the conducting copper posts; manufacturing an outer layer rigid board circuit by adopting an addition process electroplating technology on the insulation bonding layer; performing hollowing processing on a subsided region; and performing steel board reinforcement processing on the bottom part of the subsided region. According to the invention, the conducting copper posts manufactured through addition electroplating are adopted to replace traditional drilling holes and laser drilling holes for conduction; the minimum diameter of each conducting copper post can be as small as 0.05 mm; wiring can be performed on the conducting posts and the minimum wire width\wire space of the circuit manufactured by using the addition process can be 15\15 micrometers. Therefore, circuit fineness is improved and wiring density is improved substantially. The invention also has characteristics of simple manufacture process and low cost and area available for wiring is enlarged.

The invention relates to a preparation method of a double-face copper pouring ceramic substrate. The method comprises the steps that first, a ceramic sheet base material and copper sheets are washed; second, the copper sheets are subjected to annealing treatment in a first protective atmosphere, wherein the annealing temperature is 500-1060 DEG C, and the annealing treatment time is 1-30 min; third, in a second protective atmosphere, a first copper sheet, a ceramic sheet, a second copper sheet are stacked on a shim in sequence for sintering, wherein the sintering temperature is 1065-1082 DEG C, and the sintering time is 1-100 min; fourth, when the sintering ends, the double-face copper pouring ceramic substrate is obtained. According to the preparation method of the double-face copper pouring ceramic substrate, the ceramic sheet base material and the copper sheets are subjected to the sintering on the shim, wherein the shim does not react with the copper and low damage to the copper, so that the product obsolescence caused by the ceramic powder contamination is avoided; the double-face simultaneous sintering is achieved, so that the large heat stress generated by the single-face sintering and the continuous growth of copper grains in the second high temperature process can be avoided, and therefore the production efficiency and the yield are greatly improved.

The invention is used for overcoming the heat of chip transmitted to PCB. It comprises: the bounding pad of the heated chip and the bounding pad of metallic shielding box, both are connected using copper sheet. The heat via holes or heat buried holes or heat blind holes under the bounding pad of the heated chip has less quantities and densities, and the copper pour on the portion of PCB except the top portion of PCB is less than the top portion of PCB near the heated chip. By the invention the heat from BCP is transmitted to direction of the metallic shielding box.

The invention provides a linewidth compensation method for manufacturing a printed circuit board, comprising: providing a printed circuit board to be etched, which comprises a developing dense line zone and a sparse line zone; designing linewidth compensation: increasing a preset compensation width to the line of the sparse line zone, pasting the copper pouring zone corresponding to the preset compensation width to a dry film, and then performing exposure and development process treatment; and etching: performing etching treatment on the printed circuit board to be etched after a linewidth compensation design step, allowing the copper foil width of the sparse line zone after etching to be equal with the copper foil width of the dense line zone. Compared with the prior art, through the linewidth compensation method for manufacturing a printed circuit board, the linewidth of the dense line zone after printed circuit board etching is the same with the linewidth of the sparse line zone, and the reliability of the printed circuit is improved.

The invention discloses a copper pour use aluminum nitride substrate pretreatment method which is a key process in the preparation process of an aluminum nitride DBC (direct bond copper) plate, and the method comprises the following steps: 1, aluminum nitride substrate surface cleaning; 2, aluminum nitride substrate activation for exposure of a new high-activity surface of the aluminum nitride by use of an alkali lye; 3, preparation of an aluminum nitride substrate surface transition layer which is a composite layer containing copper, manganese, calcium, aluminum and other ions; and 4, thermal oxidation treatment of the aluminum nitride substrate surface to form a composite modified layer. The copper pour use aluminum nitride substrate pretreatment method reduces the harsh conditions of aluminum nitride surface pretreatment in the aluminum nitride DBC process; the prepared aluminum nitride transition layer is a composite oxide layer, can smoothly and fully wet copper oxide on the surface of an oxygen-free copper sheet and spread at high temperature, and reacts to bond, adhesion strength of the aluminum nitride and the copper sheet is high, the hole rate is low, and the product anti temperature cycle performance is good.

The invention relates to methods for preparing a copper-plate surface modifying WC-Cu alloy layer for a continuous-cast crystallizer and an application thereof. The WC-Cu alloy layer is especially suitable for a copper plate modifying layer of a crystallizer for continuously casting steel and nonferrous metal. The modifying layer comprises 30.0-70.0wt% of WC, 23.0-69.65wt% of Cu, 0.1-2.0wt% of Ni,0.05-2.0wt% of Ag and 0.2-3.0wt% of Co. The following two methods can used for preparing the WC-Cu alloy layer: a. hot pressed sintering which is characterized by (1) uniformly mixing power and forming by hot pressed sintering; and (2) casting molten copper on the sintered WC-Cu alloy, or placing a copper plate on the WC-Cu alloy, heating to melt down the copper, carrying out infiltration with the WC-Cu alloy, cooling, and then obtaining a copper plate product with the WC-Cu alloy modification layer; and b. infiltration method which is characterized by (1) uniformly mixing power, cold pressing the power into infiltration frame and sintering the infiltration frame at a high temperature; and (2) casting the molten copper on the WC-Cu alloy frame for infiltration, or placing a copper plate on the WC-Cu alloy frame, heating to melt down the copper, carrying out infiltration with the WC-Cu alloy frame and cooling. The WC-Cu alloy layer has the advantages of greatly improving the productivity of the crystallizer and solving the problem of pollution caused by copper plate galvanization of the crystallizer, and the invention provides a high-efficiency and environment-friendly crystallizersurface modification method.

The invention relates to the technical field of a mobile terminal and discloses an antenna and on-off key integrated FPC (flexible circuit board) and the mobile terminal. The FPC comprises a copper pouring region, an antenna energy feed point, an on-off key energy feed point, a grounding bonding pad and an on-off key spring sheet. The FPC of the on-off key is used; the antenna energy feed point and a main body are arranged on the FPC, wherein the antenna energy feed point, the copper pouring region and the grounding bonding pad are connected to form the main body of the antenna, equivalently, the FPC of the on-off key is transformed into the antenna; the on-off key energy feed point is also electrically connected with the on-off key spring sheet, so that the functions of the on-off key are maintained on the FPC; and the antenna and on-off key integrated FPC has the advantages that the antenna and the on-off key of power source share the FPC, so that a conventional BT/WIFI (British Telecom/Wireless Fidelity) antenna can be saved, the cost of the antenna is reduced, the antenna and on-off key integrated FPC is easy to realize and is suitable for mass production, and an ultra-thin mobile phone is prevented from limiting the antenna region to influence the normal working of the antenna.

A high thermal conductivity package substrate and a preparation method thereof are disclosed. The preparation method includes the steps of: electroplating a copper substrate with a metal protective layer; addition-electroplating the copper substrate with a first line layer; forming a first conductive copper post and a first heat-dissipating copper post on the first line layer, and electroplating the first conductive copper post and the first heat-dissipating copper post; pressing a first insulating layer on the first line layer and performing grinding; forming a second line layer on the firstinsulating layer; forming a second conductive copper post and a second heat dissipating copper post on the second line layer, and pressing a second insulating layer on the second line layer and performing grinding; forming a third line layer on the second insulating layer; and etching the copper substrate. The heat-dissipating copper posts can allow a simple heat conductive path, and the heat dissipating effect is improved; the preparation process is simple, the cost is low, the prepared high thermal conductivity package substrate is stable in size, the conductive path is simple, and the heatdissipating performance is excellent.

The invention discloses a pouring system for copper artware. The pouring system comprises an annular runner (3), a semicircular runner (2), a cavity (5) and a plurality of vertical runners (1), wherein the annular runner (3) is arranged vertically above the cavity (5), and communicated to the top end of the cavity (5) through the plurality of vertical runners (1), and a first pouring inlet is arranged in the annular runner (3); and the first end of the semicircular runner (2) is communicated to the bottom end of the cavity (5), a second pouring inlet is arranged in the second end of the semicircular runner (2), and the second end is as high as the cavity (5). The pouring system for the copper artware overcomes the problems that damages of the cavity are liable to cause, and molten copper is liable to oxidize during a pouring process in the prior art, and realizes the functions of protection and anti-oxidation during the copper pouring process.

The invention discloses an antenna small panel, an antenna structure and a mobile terminal. The antenna small panel comprises a panel body, an antenna feed point and a radio frequency connector, wherein one surface of the panel body includes a copper-poured area, a wiring area and a clearance area which are arranged up and down, and the copper-poured area and the wiring area are arranged at the same side and are respectively adjacent to the clearance area; the antenna feed point is arranged in the clearance area; the radio frequency connector is arranged in the wiring area and is connected with the antenna feed point by virtue of a feed wire; and one side of the copper-poured area extends toward the clearance area to form an extended section, and the tail end of the extended section is connected with the feed wire. The invention aims at providing the antenna small panel, the antenna structure and the mobile terminal, so as to solve the problem that antenna performance at a certain sideis poor due to influence of the head and hands.

The invention relates to the technical field of PCB (printed circuit board) processing, and discloses a PCB isolation graph copper pouring and distributing secondary etching method which includes thesteps: a copper pouring film optimization; b graph transfer; c graph electroplating; d graph etching; e secondary graph transfer; f secondary etching. The method is applicable to secondary etching ofcopper pouring and distributing of PCBs with locally isolated graphs and the copper thickness smaller than 2OZ, production defect rate is greatly reduced, and the method is low in cost, high in efficiency and suitable for large-scale popularization.

A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.