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Method for producing high-conductivity oxygen-free copper and smelting device

A high-conductivity, oxygen-free copper technology, applied in stirring devices, lighting and heating equipment, furnace components, etc., can solve the problems of high production cost, copper volatilization, limited heating and volatilization time, etc., to increase contact The effect of area, low production cost and short production cycle

Inactive Publication Date: 2013-03-27
JINZHOU NEW CENTURY QUARTZ GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses vacuum heating to remove oxygen and impurities, but the heating volatilization time is limited (too long volatilization time will cause a large amount of copper to be volatilized), which limits the ability of vacuum deoxidation and impurity removal, and the used Electrolytic copper raw materials have high requirements on purity and high production costs

Method used

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  • Method for producing high-conductivity oxygen-free copper and smelting device
  • Method for producing high-conductivity oxygen-free copper and smelting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] As shown in the figure, the high-conductivity oxygen-free copper compound device includes a vacuum melting furnace body 1, a main heater 3 is arranged in the vacuum melting furnace body 1, and the cavity of the vacuum melting furnace body 1 A graphite crucible 4 is arranged at the position corresponding to the main heater 3 inside, and a liquid discharge port 401 is provided at the bottom of the graphite crucible 4, and a liquid discharge control valve 7 is provided on the liquid discharge port 401, which is connected with the furnace body of the vacuum melting furnace. The corresponding position of the drain control valve 7 is provided with an auxiliary heater 2; a graphite agitator 5 is suspended in the graphite crucible 4, and the graphite agitator 5 is connected to the central position of the sieve plate 501 by a sieve plate 501 through threads. Composed of lifting rods 502, the sieve holes on the sieve plate 501 in this embodiment are round holes (or square holes). ...

Embodiment 2

[0046] The equipment for preparing high-conductivity oxygen-free copper is the same as that in Example 1.

[0047] During production, the specific steps are as follows:

[0048] 1. Clean raw materials

[0049] Select high-purity electrolytic copper blocks with a purity > 99.95% as raw materials, the iron content of the electrolytic copper blocks is < 2ppm, soak in hydrochloric acid with a mass concentration of 10% at room temperature for 15 minutes, rinse with deionized water, and dry;

[0050] 2. Loading

[0051] Put the dried copper block into the graphite crucible 4, and the material of the graphite crucible 4 is high-purity graphite with ash content<50ppm;

[0052] 3. Melting raw materials

[0053] After the copper block is installed in the graphite crucible 4, start vacuuming. When the vacuum degree reaches 10Pa, start the main heater 3, heat the copper block to 1000°C, and vacuumize the vacuum melting furnace to 0.009Pa, keep it warm for 5h, and fill with protective gas...

Embodiment 3

[0059] In this embodiment, the chemical device for preparing high-conductivity oxygen-free copper is the same as that in Embodiment 1.

[0060] During production, the specific steps are as follows:

[0061] 1. Clean raw materials

[0062] High-purity electrolytic copper blocks with a purity >99.95% are selected as raw materials, and the iron content of the electrolytic copper blocks is <2ppm, soaked in hydrochloric acid with a mass concentration of 10% at room temperature for 15 minutes, rinsed with deionized water, and dried;

[0063] 2. Loading

[0064] Put the dried copper block into the graphite crucible 4, and the material of the graphite crucible 4 is high-purity graphite with ash content<50ppm;

[0065] 3. Melting raw materials

[0066] After the copper block is installed in the graphite crucible 4, start vacuuming. When the vacuum degree reaches 10Pa, start the main heater 3, heat the copper block to 950°C, and vacuumize the vacuum melting furnace to 0.009Pa, keep i...

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Abstract

The invention relates to a method for producing high-conductivity oxygen-free copper and a smelting device. According to the method, high-purity electrolytic copper blocks are washed cleanly, dried and fed into a graphite crucible, and is vacuumized, and a main heater is started to smelt the copper blocks into a copper liquid; a graphite mixer suspended in the graphite crucible is started to make up-down reciprocating movement and mixing in the graphite crucible to obtain liquid oxygen-free copper, and the liquid oxygen-free copper is poured in an ingot puller for crystallization and ingot pulling to obtain oxygen-free copper ingots. The smelting device comprises a vacuum smelting furnace body, the main heater and the graphite crucible which is arranged in a receiving cavity of the furnace body, wherein the bottom of the graphite crucible is provided with a liquid discharge port and a liquid discharge control valve. The smelting device is characterized in that the graphite mixer capable of lifting is suspended in the graphite crucible. The method and the smelting device have the advantages that the use of the graphite mixer for mixing increases the contact area between oxygen gas and graphite in copper liquid, and high-efficiency oxygen removal is achieved; and the requirements for the raw materials are not strict, the production cost is low, and the conductivity of the oxygen-free copper produced meets the requirements of high-class conducting wires.

Description

technical field [0001] The invention relates to a method for preparing high-conductivity oxygen-free copper and a chemical material device. Background technique [0002] Oxygen-free copper is a metal material with high conductivity, corrosion resistance, low temperature resistance, good processing and welding performance, and is widely used in sputtering targets, high-end audio cables and high-end microelectronic device connection cables. The national standard TU0 oxygen-free copper and the American standard C10100 oxygen-free copper are both high-grade copper materials, with an electrical conductivity of IACS 101% and a residual resistivity of 200. In the application of high-end wires such as superconductor cables and particle accelerator components, oxygen-free copper with higher conductivity has become the main research direction. Currently, the conductivity of oxygen-free copper can reach IACS 102%. [0003] The improvement of copper conductivity is related to the reduc...

Claims

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Application Information

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IPC IPC(8): C22C1/02C22C9/00F27D27/00
Inventor 张海涛张海霞车永军
Owner JINZHOU NEW CENTURY QUARTZ GROUP CO LTD
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