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Manufacturing method of flexible circuit board

A flexible circuit board and manufacturing method technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problem of uneven thickness of conductive lines, different dry film thickness of copper-clad substrates, and thin copper-clad substrates. Wrinkle and other problems are prone to occur, and the effect of improving production accuracy, increasing thickness and simple operation is achieved.

Inactive Publication Date: 2010-02-03
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thin copper-clad substrates are prone to wrinkling, which affects the production of circuit boards. For example, in the lamination process, due to the wrinkling of the copper-clad substrate, the thickness of the dry film laid on the copper-clad substrate varies, which in turn causes subsequent production. The thickness of the conductive lines is uneven, which seriously affects the quality of the circuit board

Method used

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  • Manufacturing method of flexible circuit board
  • Manufacturing method of flexible circuit board
  • Manufacturing method of flexible circuit board

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Embodiment Construction

[0016] The method for manufacturing the flexible circuit board provided by the technical solution will be described in detail below with reference to the embodiments and the accompanying drawings.

[0017] The manufacturing method of the flexible circuit board comprises the following steps:

[0018] In the first step, the reinforcement board 10 and the copper-clad substrate 20 are provided.

[0019] See figure 1 The reinforcement board 10 used in this embodiment includes a base material layer 11 and two adhesive layers 12 respectively disposed on opposite surfaces of the base material layer 11 . The two adhesive layers 12 are used for adhering the copper-clad substrate 20 in subsequent processes. The material of the substrate layer 11 is preferably a plastic with large tensile strength and flexural strength, hygroscopicity, heat resistance, dimensional stability and chemical stability, such as polyimide, polyethylene naphthalene, polyethylene terephthalate Glycol esters or ...

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Abstract

The invention relates to a manufacturing method of a flexible circuit board, comprising the following steps: providing a reinforcing plate and a copper pour base material, and the reinforcing plate comprises a base material layer and an adhesive layer arranged on the surface of the base material layer; the copper pour base material comprises an insulating layer and a conducting layer arranged on the surface of the insulating layer. The manufacturing method in the invention comprises the following steps: adhering the copper pour base material to the reinforcing plate and leading the conductinglayer to be exposed; forming a conducting circuit in the conducting layer to manufacture a circuit board; separating the reinforcing plate from the circuit board. The method can avoid the copper pourbase material from buckling and improve the manufacturing precision of the circuit board.

Description

technical field [0001] The invention relates to the field of circuit board manufacture, in particular to a method for manufacturing a flexible circuit board. Background technique [0002] Flexible circuit boards are usually made of copper-clad substrates, which can be divided into single-sided circuit boards, double-sided circuit boards and multi-layer circuit boards. Among them, the manufacturing process of single-sided circuit boards usually includes processes such as lamination, exposure, development, etching, and gold plating. See literature: Traut, G.R; Rogers Corp., CT; Manufacturing and integration techniques of microwave circuits; IEEE colloquium on, Page 4 / 1~4 / 4; published on 10th Oct, 1988. The production of double-sided circuit boards also includes processes such as making via holes and plating via holes. The multi-layer circuit board is usually manufactured by lamination method, specifically, it includes the following steps: the first step is to form a conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/007H05K2203/1572H05K1/0393H05K2203/0156H05K3/061H05K2203/1536H05K2203/1545H05K3/0097
Inventor 张琪
Owner AVARY HLDG (SHENZHEN) CO LTD
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