Linewidth compensation method for manufacturing printed circuit board

Abstract

The invention provides a linewidth compensation method for manufacturing a printed circuit board, comprising: providing a printed circuit board to be etched, which comprises a developing dense line zone and a sparse line zone; designing linewidth compensation: increasing a preset compensation width to the line of the sparse line zone, pasting the copper pouring zone corresponding to the preset compensation width to a dry film, and then performing exposure and development process treatment; and etching: performing etching treatment on the printed circuit board to be etched after a linewidth compensation design step, allowing the copper foil width of the sparse line zone after etching to be equal with the copper foil width of the dense line zone. Compared with the prior art, through the linewidth compensation method for manufacturing a printed circuit board, the linewidth of the dense line zone after printed circuit board etching is the same with the linewidth of the sparse line zone, and the reliability of the printed circuit is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a line width compensation method for printed circuit board production. Background technique [0002] With the rapid development of electronic technology, the circuit refinement degree of printed circuit boards has gradually shifted to microscopic micron-scale dimensions, and the precision requirements of circuits are getting higher and higher. [0003] In the layout design of printed circuit boards, there are usually dense lines in some areas of the inner and outer layers. In related technologies, the compensation of the line width is uniformly compensated according to the thickness of the bottom copper. The difference in fluidity in areas with different wiring densities leads to differences in the activity of etching chemicals in areas with different wiring densities, which will cause the line width of the sparse line area of ​​the printed circuit board ...

AI Technical Summary

Problems solved by technology

[0003] In the layout design of printed circuit boards, there are usually dense lines in some areas of the inner and outer layers of the circuit. In related technologies, the compensation of the line width is uniformly compensated according to the thickness of the bottom copper. The difference in fluidity in areas with different wiring densities leads to differences in the activity of etching solutions in areas with different wiring densities, which will cause the line width of the sparse line area of ​​the printed circuit board to be smaller than that of the dense line area, or the line burrs in the dense line area Too large, the etched board is not clear, resulting in poor quality or scrapped circuit boards

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