Manufacturing method for semi-flexible printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, chemical instruments and methods, etc., can solve problems such as high difficulty in process control, complicated process flow, and low product reliability, and achieve cost reduction, The processing flow is simple, and the effect of improving the yield and reliability

Inactive Publication Date: 2009-02-11
CHINA CIRCUIT TECH SHANTOU CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the manufacturing process of rigid-flexible printed circuit boards, there are disadvantages such as complex process flow, expensive product materials,...

Method used

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  • Manufacturing method for semi-flexible printed circuit board
  • Manufacturing method for semi-flexible printed circuit board
  • Manufacturing method for semi-flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Such as Figure 1 to Figure 4 As shown, the manufacturing method (milling method) of the semi-flexible printed circuit board in the present preferred embodiment comprises the following steps:

[0066] (1) Prepare the sheet material, which is the rigid base plate 1; if figure 1 As shown, the above-mentioned rigid bottom plate 1 adopts a glass cloth-epoxy resin copper-clad board, and the glass cloth-epoxy resin copper-clad board is a double-sided board, including an upper conductive layer 11, an intermediate insulating layer 10 and a lower conductive layer 12, The upper conductive layer 11 is pressed together with the lower conductive layer 12 through the intermediate insulating layer 10 . The above-mentioned upper and lower conductive layers 11 and 12 are copper foil layers, and the above-mentioned intermediate insulating layer 10 is a resin layer.

[0067] (2) Divide the rigid base plate 1 into a forming area 8 (area within the dotted line) and an exterior area 9 (are...

Embodiment 2

[0073] Such as Figure 5 to Figure 8 As shown, the manufacturing method (milling method) of the semi-flexible printed circuit board in embodiment 2 comprises the following steps:

[0074] (1) prepare sheet material, this sheet material comprises rigid base plate 1, core plate 5 and prepreg 6, and above-mentioned core plate 5 is single-layer core plate 51; Figure 5 As shown, the above-mentioned rigid base plate 1 is the same as the rigid base plate 1 in Embodiment 1, and the above-mentioned single-layer core plate 51 is also basically the same as the rigid base plate 1 in Embodiment 1, but the name is different.

[0075] (2) Pre-dividing the rigid base plate 1, the core plate 5 and the prepreg 6 into a forming area 8 and an exterior area 9;

[0076] (3) In the molding area 8, the rigid base plate 1, the core plate 5 and the prepreg 6 are pre-divided into a flat plate area 2 and a flexible bending area 3;

[0077] (4-1) Perform graphic processing on the pressing surface of th...

Embodiment 3

[0084] Such as Figure 9 to Figure 13 As shown, the manufacturing method (opening method) of the semi-flexible printed circuit board in embodiment 3 comprises the following steps:

[0085] (1) Prepare the sheet material, which includes a rigid base plate 1, a core plate 5 and a prepreg 7; the structure of the rigid base plate 1 is the same as that of the rigid base plate 1 in Implementation 1, and the above-mentioned core plate 5 adopts a two-layer core plate, and the core plate 5. The single-layer core board 51 and the single-layer core board 52 are pressed together by the prepreg 6 to form a multi-layer core board. Certainly, the above-mentioned core board 5 can also adopt a single-layer core board 51 or a multi-layer core board with more than two layers; the above-mentioned prepreg 7 adopts a low-fluidity prepreg (No FLOW);

[0086] (2) Pre-dividing the rigid base plate 1, the core plate 5 and the prepreg 7 into a forming area 8 and an exterior area 9;

[0087] (3) In the...

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Abstract

A production method of a semi-flexible printed circuit board comprises the following steps of: (1) preparing a sheet metal; (2) dividing the sheet metal into a molding area and a shaping area; (3) dividing the molding area into a plate area and a flexible area in advance in the molding area; (4) processing the sheet medal as follows: (4.1) processing of the pattern of the sheet metal and (4.2) processing the flexible bent area of the sheet metal so that the flexible area becomes thinner and can be bent; and (5) removing the shaping area and getting the semi-flexible printed circuit board. The invention adopts cheap general rigid materials such as glass fabric-epoxide resin copper pour foil, and the like to replace expensive flexible copper pour plate materials such as polyimide, and the like, thereby greatly reducing the cost. At the same time, the invention has the advantages of simple machinery process, high rate of finished products and high reliability. The semi-flexible printed circuit board produced by the method particularly suits vehicle-borne products with higher reliability requirement.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, more specifically, to a method for manufacturing a semi-flexible printed circuit board. Background technique [0002] Existing printed circuit boards generally include flexible printed circuit boards, rigid printed circuit boards and rigid-flexible printed circuit boards. [0003] Flexible Printed Circuit Board (FPC for short) is mainly used to carry electronic components, such as integrated circuit chips, resistors, capacitors, connectors and other components, so that electronic products can perform the intended functions, usually used in small Or the connection between thin electronic mechanisms and hard boards. Flexible printed circuit boards are used in a wide range of fields, such as computers, communications machines, instrumentation, medical equipment, military and aerospace. The development and wide application of flexible printed circuit boards is due to its signifi...

Claims

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Application Information

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IPC IPC(8): H05K3/00B32B27/04B32B15/08B32B17/04
Inventor 刘建生何润宏刘慧民辜小谨陈敏林辉
Owner CHINA CIRCUIT TECH SHANTOU CORP
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