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Rigid-flex board and mobile terminal

A soft-rigid combination board and hard layer technology, applied in the structural connection of printed circuits, printed circuit components, printed circuits, etc., can solve the problems of insufficient wiring space of flexible circuit boards, meet wiring requirements, and increase wiring space. Effect

Active Publication Date: 2019-02-22
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when more electronic components need to be arranged on the flexible circuit board, it is often difficult to meet the requirements due to the insufficient wiring space of the flexible circuit board.

Method used

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  • Rigid-flex board and mobile terminal
  • Rigid-flex board and mobile terminal

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0022] For ease of description, spatially relative terms such as "below", "below", "below", "above", and "up" can be used here to describe an element as shown in the figure. Or the relationship between a feature and another element(s) or feature. It will be understood that when an element or layer is referred to as being "on", "connected to" or "coupled" to another element or layer, it can be directly on the other element or layer. Conn...

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Abstract

The invention provides a soft and rigid combination plate and a mobile terminal. The soft and rigid combination plate comprises a first flexible substrate layer, a first copper foil layer, a rigid layer and a second copper foil layer, wherein the first copper foil layer is laminated on the first flexible substrate layer; the first copper foil layer comprises a reinforcing region and a connection region which is separated from the reinforcing region; the ridged layer covers the reinforcing region; the second copper foil layer is laminated on the connection region; and the second copper foil layer extends along the direction far away from the rigid layer. According to the soft and rigid combination plate and the mobile terminal, provided by the invention, the first copper foil layer comprises the reinforcing region and the connection region, and the reinforcing region and the connection region are connected with the rigid layer and the second copper foil layer respectively. With the adoption of the manner, the second copper foil layer is laminated on the connection region of the first copper foil layer, so that the first copper foil layer and the second copper foil layer can be subjected to wire arrangement, and furthermore, a wire arrangement space of a soft plate part of the soft and rigid combination plate can be increased and wire arrangement requirements on different electronic components by the soft and rigid combination plate are met.

Description

Technical field [0001] The present invention relates to the technical field of circuit boards, in particular to a flexible and hard combined board and a mobile terminal. Background technique [0002] Rigid-flex board is a circuit board with flexible circuit board characteristics and rigid circuit board characteristics by combining the flexible circuit board and the rigid circuit board through processes such as pressing and combining according to the relevant process requirements. [0003] At present, in the production of rigid-flex boards, it is usually necessary to configure the boards and equipment for the production of rigid circuit boards and flexible circuit boards at the same time. Then, after the flexible circuit boards and rigid circuit boards are produced separately, machines such as laminating machines or laminating machines are used. Press together. [0004] However, with the above method, the number of layers used in the flexible circuit board and the rigid circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/147H05K3/361H05K2201/2009H05K2201/2018
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD