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Wafer alignment detection method and system

A detection method and wafer technology, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as poor positioning accuracy of wafers and slow alignment speed

Active Publication Date: 2018-11-09
CETC BEIJING ELECTRONICS EQUIP
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a wafer alignment detection method and system to solve the problems that most of the existing semiconductor detection equipment is aligned manually, resulting in slow alignment speed and poor positioning accuracy of wafers

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  • Wafer alignment detection method and system
  • Wafer alignment detection method and system
  • Wafer alignment detection method and system

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Embodiment Construction

[0076] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0077] The present invention aims at the problems of slow alignment speed and poor positioning accuracy of wafers caused by manual alignment of most existing semiconductor inspection equipment, and provides a wafer alignment inspection method and system.

[0078] Such as figure 1 As shown, the wafer alignment detection method of the embodiment of the present invention includes:

[0079] Step 11, first aligning the wafer on the workbench to obtain a first rotation angle of the wafer, and rotating the wafer according to the first rotation angle;

[0080] Step 12, perform a second alignment on the rotated wafer to obtain a second rotation angle of the wafer, and rotate the wafer according to the second rotation angle so that the scribe groove of the r...

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Abstract

The invention provides a wafer alignment detection method and system. The wafer alignment detection method comprises the following steps: carrying out first alignment on a wafer located on a work bench, obtaining a first rotation angle of the wafer and rotating the wafer according to the first rotation angle; and carrying out second alignment on the rotated wafer, obtaining a second rotation angle of the wafer and rotating the wafer according to the second rotation angle, thereby making a cutting groove of the rotated wafer parallel to an X-axis of the work bench. According to the scheme, alignment of the wafer on the work bench is achieved in an automatic alignment manner, so that the labor cost is reduced; and the wafer alignment efficiency and accuracy are greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor detection, in particular to a wafer alignment detection method and system. Background technique [0002] Semiconductor testing equipment is an intermediate testing equipment on the semiconductor process line. After connecting with the tester, it can automatically complete the electrical parameter testing and functional testing of integrated circuits and various transistor cores. [0003] At present, most of the alignment and positioning operations of semiconductor testing equipment on the production line need to be completed manually, which takes a long time and the positioning accuracy is not high, which seriously affects the testing efficiency of the equipment. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a wafer alignment detection method and system to solve the problems that most of the existing semiconductor detection equ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/67
CPCH01L21/67259H01L21/681
Inventor 刘国敬张文斌高岳
Owner CETC BEIJING ELECTRONICS EQUIP
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