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Manufacturing method of projection optical system and device manufacturing method

A technology of a projection optical system and a manufacturing method, which is applied to microlithography exposure equipment, photolithographic process exposure devices, etc., can solve the problems of narrowing the imaging performance adjustment range of the projection optical system, unable to fully adjust the projection magnification, etc.

Active Publication Date: 2018-02-23
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the optical component is moved in the adjustment process, the amount of movement of the optical component required to adjust the projection magnification in the exposure process may exceed the movable range of the optical component, and the projection magnification cannot be adjusted sufficiently.
That is, the adjustment range of the imaging performance of the projection optical system becomes narrow

Method used

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  • Manufacturing method of projection optical system and device manufacturing method
  • Manufacturing method of projection optical system and device manufacturing method
  • Manufacturing method of projection optical system and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0014] figure 1 It is a schematic diagram of an exposure apparatus. The exposure apparatus includes an illumination optical system IL and a projection optical system PO. Between the illumination optical system IL and the projection optical system PO, the mask stage 2 capable of holding and moving the mask 1 on which the circuit pattern of the device to be manufactured is drawn is disposed. As a light source included in the illumination optical system IL, for example, a high-pressure mercury lamp can be used. However, as for the light source, a device suitable for the device to be manufactured can be arbitrarily selected. The illumination optical system IL illuminates the mask 1 with light from a light source, and projects an image of the pattern of the mask 1 onto the substrate 3 held on the substrate stage 4 by the projection optical system PO. A photoresist sensitive to exposure light is coated on the substrate 3 , and the exposure pattern is developed to form a resist pa...

no. 2 Embodiment approach

[0040] Next, according to Figure 5 , the method of manufacturing the projection optical system in the second embodiment will be described. Figure 5 It is a flowchart showing the manufacturing method of the projection optical system in this embodiment.

[0041] S401 to S403 are the same as the preceding S201 to S203, so the description is omitted.

[0042] Next, a sensor is used to measure the current position of the movable mechanism of the driving unit included in the refractive optical member 5, 10, and the controller 13 obtains a measurement signal from the sensor to obtain information on the current position (S404). Based on the obtained position information, the controller 13 controls the drive unit to move the movable mechanism to the center position by setting the center position of the moving range of the movable mechanism (drive range of the driving unit) as a target position ( S405 ).

[0043] Next, using an aberration measuring device, the aberration of the proj...

no. 3 Embodiment approach

[0049] Next, the manufacturing method of the device (semiconductor IC element, a liquid crystal display element, etc.) using the said exposure apparatus is demonstrated. First, a projection optical system is manufactured by the above-described manufacturing method. Then, an image of the pattern of the mask is projected onto a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent through the projection optical system using an exposure apparatus equipped with the produced projection optical system to expose the substrate. Then, a device is manufactured through a step of developing the exposed substrate (photosensitive agent) and other known steps of processing the developed substrate. Among other well-known processes, etching, resist stripping, dicing, bonding, packaging, and the like are included. According to this device manufacturing method, it is possible to manufacture a device of higher quality than before.

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Abstract

The present invention relates to a method of manufacturing a projection optical system and a method of manufacturing a device. Provided is a projection optical system capable of sufficiently ensuring an adjustment range of imaging performance of the projection optical system. A method of manufacturing a projection optical system, comprising: a step of assembling a projection optical system by arranging a plurality of optical components including a movable optical component including a drive unit; A process of projecting an optical system; a process of acquiring information on aberrations of the projection optical system in a state in which the driving unit is moved to a predetermined position determined according to its driving range; The step of performing processing; and the step of incorporating the processed optical component for processing into the projection optical system, further comprising a step of moving the driving unit to a predetermined position determined based on the driving range.

Description

technical field [0001] The present invention relates to a method of manufacturing a projection optical system and a method of manufacturing a device. Background technique [0002] The exposure device illuminates a mask (reticle) in the photolithography process that is the manufacturing process of semiconductor devices, liquid crystal display devices, etc., and transfers the pattern of the mask to the photosensitive coated film through the projection optical system. The device on the substrate (wafer, glass plate, etc.) of the agent (resist). [0003] For example, among projection exposure apparatuses for transferring a pattern to a glass plate, in recent years, exposure apparatuses for collectively exposing a larger-area pattern on a mask on a substrate have been demanded. In order to meet this demand, a scanning type projection exposure apparatus of a step and scan system capable of obtaining high resolution and exposing a large screen has been proposed. In this scanning ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 大野文靖
Owner CANON KK