Coated aluminum entry board for PCB and preparation method of coated aluminum entry board
A technology of aluminum cover and gluing, applied in coatings, polyether coatings, polyurea/polyurethane coatings, etc., can solve the problems of increasing drilling cost, decreasing hole position accuracy, increasing needle breakage rate, etc., and reducing drilling cost, reduce needle breakage rate, and improve the effect of hole position accuracy
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] Add nano-scale aluminum oxide powder with a solid content of 10% by weight to the original glue solution and stir evenly, and evenly coat the glue solution on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding aluminum oxide powder. Comparing the drilling results, adding Al2O3 powder is smaller than not adding Al2O3 powder, and the needle breakage rate is equivalent.
[0023] Add nano-scale silica powder with a solid content of 10% by weight to the original glue solution and stir evenly, and apply the glue solution evenly on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding silicon dioxide powder. Comparing the drilling results, adding silica is smaller than not adding silica, and the needle breakage rate is equivalent.
Embodiment 2
[0025] Add nano-scale aluminum oxide powder with a solid content of 20% by weight to the original glue solution and stir evenly, and apply the glue solution evenly on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding aluminum oxide powder. Comparing the drilling results, the wire winding with Al2O3 powder is smaller than that without Al2O3 powder, and the broken needle rate with Al2O3 powder is lower than that without Al2O3 powder.
[0026] Add nano-scale silica powder with a solid content of 20% to the original glue solution and stir evenly, and evenly coat the glue solution on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding silicon dioxide powder. Comparing the drilling results, adding silica powder is smaller than not adding silica powder, and the broken needle rate is lower than adding silica powder than not adding silica powder.
Embodiment 3
[0028] Add nano-scale aluminum oxide powder with a solid content of 30% by weight to the original glue solution and stir evenly, and apply the glue solution evenly on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding aluminum oxide powder. Comparing the drilling results, the one with Al2O3 powder has no wire wrapping, the one without Al2O3 powder has wire wrapping, the broken needle rate of adding Al2O3 powder is 0.1-0.3%, and that of not adding Al2O3 powder is 0.1-0.3%. The broken needle rate is 0.5-0.8%.
[0029] Add nano-scale silica powder with a solid content of 30% by weight to the original glue solution and stir evenly, and apply the glue solution evenly on the aluminum sheet. The thickness of the coating is equal to the thickness of the glue layer without adding silicon dioxide powder. Comparing the drilling results, the one with silica powder has no wire wrapping, the one without silica powder has wrapping wire...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap