Ring structure and manufacturing method thereof

Abstract

The invention provides a ring part structure and a manufacturing method thereof. The ring part structure comprises a ring body, an outer circumferential surface and two ring-shaped end faces of the ring body are connected through circular beads, an inner outer circumferential surface and the two ring-shaped end faces of the ring body are connected through circular beads, and the fillet radii of the circular beads are smaller than the width of the outer circumferential surface by a half. The manufacturing method of the ring part structure comprises the steps of forming the ring body; and carrying out chamfering treatment until the outer circumferential surface and the two ring-shaped end faces of the ring body are connected through the circular beads, the inner outer circumferential surface and the two ring-shaped end faces of the ring body are connected through the circular beads, and the fillet radii of the circular beads are smaller than the width of the outer circumferential surface by a half. The ring part structure and the manufacturing method have the beneficial effects that the superficial area of the ring body is relatively large, the ability of the ring body to adsorb particulate matter generated by sputtering is higher, and the probability of peeling is lowered; the superficial area of the ring body is larger, and therefore the probability of discharge breakdown is greatly lowered in the sputtering deposition process, and the influence of the ring part structure to the sputtering deposition process is reduced in the use process of the ring part structure.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a ring structure and a manufacturing method thereof. Background technique [0002] A sputtering process is commonly used in semiconductor manufacturing, and this process is used to sputter metal onto a substrate to form a thin film. This process is one of the physical vapor deposition (Physical Vapor Deposition, PVD), by bombarding the sputtering target with high-energy particles, the bombarded target atoms or molecules are deposited on the surface of the substrate to form a thin film. [0003] In the sputtering process, in order to improve the uniformity of sputtering deposition, a ring structure is usually arranged in the sputtering equipment to constrain the trajectory of the sputtered particles, that is to say, the ring structure plays a role in the sputtering process. to the role of focusing high-energy particles. [0004] For details, please refer to figure 1 ,...

AI Technical Summary

Problems solved by technology

[0005] However, the existing ring structure may affect the quality of sputtering deposition during use. For example, particles generated by sputtering will remain on the ring structure during the sputtering process. These particles accumulate on the ring structure and become Deposits, peeling will occur after the deposits accumulate to a certain extent. The peeled deposits will not only affect the sputtering environment, but also easily fall on the sputtering surface, resulting in product defects or even scrapping

In addition, the exfoliated deposits may also cause abnormal discharge phenomena in the sputtering equipment during the sputtering deposition process, and the sputtering equipment will stop working unexpectedly, which will affect the entire production schedule

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