Liquid silicone injection mold sealant process

Abstract

The invention discloses a silica gel sealing process for a liquid silica gel injection mold. The silica gel sealing process comprises the following steps that S1, FPC and a plastic frame are subjected to surface treatment; S2, the FPC and the plastic frame subjected to surface treatment through the S1 are put into the liquid silica gel injection mold, and liquid silica gel injection molding is conducted; and S3, a product completed and molded through the S2 is taken out and subjected to performance testing. According to the silica gel sealing process for the liquid silica gel injection mold, the surface of the FPT and the surface of the plastic frame are cleaned and activated in a plasma treatment mode, and the effect that no residual silica gel exists is achieved; and through liquid silica gel injection molding, the wall of silica gel is made to be uniform in thickness and free of burrs, and the product yield is increased.

Description

technical field [0001] The invention relates to the field of molds, in particular to a liquid silicone injection mold sealing process. Background technique [0002] In the manufacturing process of electronic products, some products need liquid silicone molding, such as figure 1 As shown, the product is composed of FPC101, silica gel 102, and plastic frame 103. FPC101 and plastic frame 103 are combined through silica gel 102. The traditional way is to use hydraulic technology to open the mold. During the production process, the following problems will occur : (1), the uneven wall thickness of silica gel makes it impossible to achieve the tolerance size accuracy of thickness 0.1+ / -0.02mm, and at the same time, it will affect the resonant frequency value of the product and cannot meet the customer's test requirements; (2), the product adhesion is not good Good, the defect rate of the air leakage test is high; (3), because the product bonding area is small, and the two products...

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Problems solved by technology

[0002] In the manufacturing process of electronic products, some products need liquid silicone molding, such as figure 1 As shown, the product is composed of FPC101, silica gel 102, and plastic frame 103. FPC101 and plastic frame 103 are combined through silica gel 102. The traditional way is to use hydraulic technology to open the mold. During the production process, the following problems will occur : (1), the uneven wall thickness of silica gel makes it impossible to achieve the tolerance size accuracy of thickness 0.1+ / -0.02mm, and at the same time, it will affect the resonant frequency value of the product and cannot meet the customer's test requirements; (2), the product adhesion is not good Good, the defect rate of the air leakage test is high; (3), because the product bonding area is small, and the two products are combined with different materials at the same time, such as figure 2 As shown, the bonding area between plastic frame 103 and silica gel 102 is 0.15 mm; the bonding area between silica gel 102 and FPC101 is 0.54 mm; in order to facilitate the bonding between products, the original process uses adhesive on the inside of FPC101 and plastic frame 103, but the bonding The curing agent will form residual glue, if the residual glue cannot be cleaned thoroughly, it will affect the subsequent welding process of the product

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