Method for forming conductive lines on insulating surface of substrate

Abstract

A method for forming a conductive line on an insulating surface of a substrate, comprising the following steps: providing a substrate, the substrate having an insulating surface; an activation layer; and forming a first metal layer on the surface of the activation layer of the substrate by an electroless plating process. In the method, an activation layer is only formed on a partial area of ​​the insulating surface of the base material by printing, so that the production of the entire activation layer can be avoided, and the cost of materials used can be reduced. Moreover, the step of forming the active layer by printing can avoid the well-known pre-roughening process, so that the production efficiency can be greatly improved.

Description

technical field [0001] The invention relates to a method, in particular to a method for forming conductive lines on the insulating surface of a base material. Background technique [0002] The current manufacturing technology of conductive circuit will first roughen the surface of the non-conductive substrate, and then use the active metal solution to make the whole surface activation layer, and then use the laser beam to conduct the lightning along a predetermined reciprocating bending path. The active layer in the non-circuit area is removed by radiation etching, and then the electroless plating and the subsequent electroplating process are carried out, so that the unremoved active layer and the electroless plating layer and electroplating layer on it form a conductive circuit on the non-conductive substrate . [0003] However, in making the conductive circuit in the above-mentioned way, since the pattern of the conductive circuit is defined by the laser etching process, ...

AI Technical Summary

Problems solved by technology

[0003] However, in making the conductive circuit in the above-mentioned way, since the pattern of the conductive circuit is defined by the laser etching process, if the non-circuit area of ​​the active layer has a large area or a complicated shape, the area should be removed by laser etching technology The active layer is not only inefficient, but may also affect the process yield, resulting in higher costs

In addition, during the process of removing the active layer by laser, the operator may not be able to effectively judge whether to remove the active layer on substrates with deep holes or curved surfaces because the active layer cannot be seen clearly, which will increase the probability of overplating. Increase

[0004] Furthermore, a large amount of active metal solution is required to make a full-surface active layer on a non-conductive substrate, which not only increases the material cost, but also increases the time to remove the active layer, thereby wasting time and cost

And the activated metal on the base material has poor preservation. If the time to remove the activated layer is too long, it will cause the circuit area of ​​the activated layer to be oxidized, so the situation of missing plating may occur during the electroless plating process, which will also cause conductive lines. increase in non-performing

Images