A method for detecting the uniformity of grinding track based on latitude and longitude

Abstract

The invention discloses a grinding path uniformity detection method based on longitude lines and latitude lines. The method comprises the steps that firstly, a longitude line and latitude line model is established on a circular substrate, and the longitude line and latitude line model comprises the longitude lines (1,2,...,i,...,n) and the latitude lines (1,2,...,j,...,n); the numbers of times that a grinding path line penetrates through the longitude line 1, the longitude line 2,..., the longitude line i,..., and the longitude line n are calculated in sequence; and the number of times that the grinding path on the longitude line 1 penetrates through the portion between the latitude line (j-1) and the latitude line j, the number of times that the grinding path on the longitude line 2 penetrates through the portion between the latitude line (j-1) and the latitude line j, and the number of times that the grinding path on the longitude line i penetrates through the portion between the latitude line (j-1) and the latitude line j are calculated in sequence, and the rest can be done in the same manner till the number of times that the grinding path on the longitude line n and on the longitude line i penetrates through the portion between the latitude line (j-1) and the latitude line j is obtained. According to the grinding path uniformity detection method, a user just needs to reasonably set a certain number of the longitude lines and the latitude lines, the density distribution of the grinding path line can be recognized; and the problem that measurement value distortion happens to the edge of the circular substrate according to a polar coordinate and Cartesian coordinate uniformity evaluation can be well solved.

Description

technical field [0001] The invention relates to the field of plane grinding, and more specifically, to a method for detecting the uniformity of grinding track based on latitude and longitude lines. Background technique [0002] Planar grinding is one of the important means to obtain high-precision surfaces such as optical components, sapphire substrates, and single-crystal silicon substrates. It is widely used in electronics, communications, computers, lasers, aerospace and other technical fields. Plane grinding must ensure flatness, surface roughness, surface and subsurface dislocation morphology and residual stress, etc. High-precision plane grinding is the necessary basis for ultra-smooth polishing. The detection method of the uniformity of the grinding track is one of the main factors restricting the precision of the plane grinding. However, the previous research mainly focused on how to improve the uniformity of grinding process, but the method of detecting the uniform...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the trajectory line density is distributed in the chip and at the edge in the existing grinding process, and the measured value is distorted, and a method for detecting the uniformity of the grinding process track based on the latitude and longitude lines is proposed, which can detect with full coverage The density distribution of the circular substrate grinding track provides global technical support for the uniformity of the grinding track and the kinematic design of the uniform wear of the grinding disc

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