Sizing die used in diode manufacturing
A technology of diodes and molds, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc. It can solve the problems that the diodes are not easy to arrange neatly, the diodes are contaminated with residual glue, and the diodes are inconvenient to take, so as to facilitate gluing and handling. Acquisition, strong practicability, and the effect of increasing efficiency and success rate
Inactive Publication Date: 2016-07-27
CHANGZHOU WUJIN HENGHUI COMM EQUIP CO LTD
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Problems solved by technology
[0003] At present, in the diode manufacturing process, it is necessary to glue both sides of the diode. The traditional mold used for gluing is inefficient in the gluing process, and the diodes are not easy to arrange neatly, so that the diodes are contaminated with residual glue, which affects the subsequent process and is easy. Causes waste, and it is inconvenient to take the diode from the mold after gluing
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[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0014] see figure 1 , the present invention provides a technical solution: a gluing mold for diode manufacturing, including a main body 1, the main body 1 is a hollow structure, and a partition 2 is provided on one side of the inner cavity of the main body 1, and a partition 2 is provided on one side of the partition 2 The first moving plate 3, the connection between the first moving plate 3 and the partition plate 2 is provided with a sliding groove, the firs...
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The invention discloses a sizing die used in diode manufacturing. The sizing die comprises a main body, wherein the main body adopts a hollow structure; a partition plate is arranged on one side of the inner cavity of the main body; a first movable plate is arranged on one side of the partition plate; a sliding block is arranged at the bottom end of the first movable plate; a first fixed plate is arranged at one end of the sliding block; a sizing cylinder is arranged on the top of the first fixed plate; the sizing cylinder adopts a hollow structure; and a placement cavity is formed in the top end of the inner cavity of the sizing cylinder. According to the sizing die used in diode manufacturing, the sizing die is equipped with the man body, the partition plate, the first movable plate, the sliding block, the first fixed plate, the sizing cylinder and the placement cavity, a second movable plate and a second fixed plate which are matched mutually in use, so that the sizing of the diodes and the taking of the sized diodes can be carried out effectively and conveniently; and meanwhile, the problems of influence on a subsequent process and the waste of the adhesive caused by that the diodes are sized with too much adhesive due to irregular arrangement of the diodes are prevented.
Description
technical field [0001] The invention relates to the technical field of electronic component manufacturing, in particular to a gluing mold for diode manufacturing. Background technique [0002] With the progress and development of society, the rapid development of science and technology, the continuous innovation and transformation of electronic technology, electronic components are constantly being applied to daily life items, therefore, the manufacturing volume of electronic components is constantly increasing, and the use of diodes in electronic components Constantly increasing. [0003] At present, in the diode manufacturing process, it is necessary to glue both sides of the diode. The traditional mold used for gluing is inefficient in the gluing process, and the diodes are not easy to arrange neatly, so that the diodes are contaminated with residual glue, which affects the subsequent process and is easy. It causes waste, and it is also inconvenient to take the diode fro...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/6715
Inventor 管建平
Owner CHANGZHOU WUJIN HENGHUI COMM EQUIP CO LTD