Groove buried hole type surface acoustic filter chip packaging structure and manufacturing method thereof

Abstract

The invention relates to a grooved buried hole type surface acoustic filter chip packaging structure and a manufacturing method thereof. The structure comprises a surface acoustic filter chip wafer (1), and the surface of the surface acoustic filter chip wafer (1) includes electrode areas (1.1) and an induction area (1.2). A laminated wafer (4) is arranged above the surface acoustic filter chip wafer (1). A cavity (7) is formed between the laminated wafer (4) and the induction area (1.2). The laminated wafer (4) is provided with holes (8) at the positions of the electrode areas (1.1), and the holes (8) are filled with conductive adhesive or electroplated metal (9). A second metal layer (10) is arranged on the surface of the conductive adhesive or electroplated metal (9), and metal balls (6) are arranged on the second metal layer (10). According to the grooved buried hole type surface acoustic filter chip packaging structure and the manufacturing method thereof of the invention, a surface acoustic filter of smaller area and size and lower manufacturing cost can be provided.

Description

technical field [0001] The invention relates to a groove buried hole type surface acoustic filter chip packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Surface acoustic filtering devices are widely used in RF and IF applications, including cellular phones, radiotelephones, and various radios. Through the use of surface acoustic filtering, these electronic devices are processed by filtering and delaying electrical signals. Due to the product performance and design functional requirements of the surface acoustic filter, it is necessary to ensure that the functional area of ​​the filter chip cannot touch any substance, that is, the cavity structure design. [0003] In the existing surface acoustic filter device packaging structure, the filter chip is connected to the ceramic substrate through conductive bump flip-chip welding and completely embedded in the cavity of the substrate,...

AI Technical Summary

Problems solved by technology

[0004] The existing packaging method of surface acoustic filter devices has a long process, high cost, and relatively large structural size. Under the current trend of electronic equipment becoming smaller and smaller, it is necessary to continuously reduce the size of electronic devices and the components used in them. Weight and Dimensions of Surface Acoustic Filter Devices

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