Packaging structure and manufacturing method of metal disc buried hole type surface acoustic filter chip

Abstract

The invention relates to a metal disc buried hole-type surface acoustic filter chip packaging structure and a manufacturing method. The structure comprises a surface acoustic filter chip wafer (1); the surface of the surface acoustic filter chip wafer (1) is provided with a first insulated layer (2); a bonded wafer (4) is arranged on the first insulated layer (2); a cavity (5) is formed between the bonded wafer (4) and the surface acoustic filter chip wafer (1); an opening (6) is arranged in the bonded wafer (4); the surface of the bonded wafer (4) is provided with a second insulated layer (7); the opening (6) is internally filled with a conductive adhesive or electroplated metal (8); the surface of the conductive adhesive or the electroplated metal (8) is provided with a second metal layer (9); and metal balls (10) are arranged on the second metal layer (9). According to the metal disc buried hole-type surface acoustic filter chip packaging structure and the manufacturing method of the invention, a surface acoustic filter device with a smaller area and a smaller size can be provided, and the manufacturing cost is lower.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method of a metal disc buried hole type surface acoustic filter chip, belonging to the technical field of semiconductor packaging. Background technique [0002] Surface acoustic filtering devices are widely used in RF and IF applications, including cellular phones, radiotelephones, and various radios. Through the use of surface acoustic filtering, these electronic devices are processed by filtering and delaying electrical signals. Due to the product performance and design functional requirements of the surface acoustic filter, it is necessary to ensure that the functional area of ​​the filter chip cannot touch any substance, that is, the cavity structure design. [0003] In the existing surface acoustic filter device packaging structure, the filter chip is connected to the ceramic substrate through conductive bump flip-chip welding and completely embedded in the cavity of the substrate...

AI Technical Summary

Problems solved by technology

[0004] The existing packaging method of surface acoustic filter devices has a long process, high cost, and relatively large structural size. Under the current trend of electronic equipment becoming smaller and smaller, it is necessary to continuously reduce the size of electronic devices and the components used in them. Weight and Dimensions of Surface Acoustic Filter Devices

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