A surface acoustic wave filter chip packaging structure

Abstract

The invention relates to a surface acoustic wave filter chip packaging structure, which includes a substrate (1), the surface of the substrate (1) is provided with a trench structure (2), and the trench structure (2) is formed by a substrate circuit (6), A chip (3) is arranged above the substrate (1), and a conductor (4) is arranged at the bottom of the chip (3), and the chip (3) is electrically connected to the circuit (5) of the substrate through the conductor (4). There is a ring of bumps (8) around the bottom of the chip (3), the bumps (8) are located in the active area of ​​the chip (3) and the periphery of the conductor (4), the bumps (8) and the trench structure (2) match, so that a cavity structure is formed in the active area of ​​the chip (3), and the periphery of the chip (3) and the trench structure (2) is encapsulated with plastic encapsulation compound. The present invention is a surface acoustic wave filter chip packaging structure, which effectively ensures the connection between the chip and the substrate through the fit design between the chip and the substrate, prevents the active area of ​​the chip from being polluted by the packaging resin, and can reduce the process steps and improve the manufacturing efficiency. yield.

Description

technical field [0001] The invention relates to a surface acoustic wave filter chip packaging structure, which belongs to the technical field of semiconductor packaging. Background technique [0002] The surface acoustic wave filter is based on the principle of sound waves, and a cavity needs to be provided in the packaging structure of the device. The existing surface acoustic wave filter uses metal bumps around the chip and the substrate to form a cavity by soldering, and the metal bumps and the substrate are connected by tin to form a rigid connection. However, the substrate has the problem of thermal expansion after being heated, and the generated heat Stress makes it difficult to control the warpage of the overall substrate, and the bonding surface between the metal bump and the substrate is prone to brittle fracture, which causes the packaging resin to flow into the gap between the substrate and the surface acoustic wave filter chip, contact the active area of ​​the ch...

AI Technical Summary

Problems solved by technology

The existing surface acoustic wave filter uses metal bumps around the chip and the substrate to form a cavity by soldering, and the metal bumps and the substrate are connected by tin to form a rigid connection. However, the substrate has the problem of thermal expansion after being heated, and the generated heat Stress makes it difficult to control the warpage of the overall substrate, and the bonding surface between the metal bump and the substrate is prone to brittle fracture, which causes the packaging resin to flow into the gap between the substrate and the surface acoustic wave filter chip, contact the active area of ​​the chip, and affect the characteristics of electronic components

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