Manufacturing method of metal wafer level etching surface acoustic filter chip packaging structure

A filter chip and packaging structure technology, applied in waveguide-type devices, circuits, electrical components, etc., can solve the problems of long process, high cost, large structure size, etc., and achieve the effect of simple process

Active Publication Date: 2019-01-29
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing packaging method of surface acoustic filter devices has a long process, high cost, and relatively large structural size. Under the current trend of electronic equipment becoming smaller and smaller, it is necessary to continuously reduce the size of electronic devices and the components used in them. Weight and Dimensions of Surface Acoustic Filter Devices

Method used

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  • Manufacturing method of metal wafer level etching surface acoustic filter chip packaging structure
  • Manufacturing method of metal wafer level etching surface acoustic filter chip packaging structure
  • Manufacturing method of metal wafer level etching surface acoustic filter chip packaging structure

Examples

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Effect test

Embodiment 1

[0065] A method for manufacturing a metal wafer-level etching type surface acoustic filter chip packaging structure, which includes the following process steps:

[0066] Step 1, see figure 2 , take a surface acoustic filter chip wafer;

[0067] Step 2. Prepare the first insulating layer

[0068] see image 3 , apply a certain thickness of insulating glue on the surface acoustic filter chip wafer with the glue coating process, such as PI (polyimide), PA (nylon, polyamide), and use photolithography and development to seal the electrode area and Removal of the insulating glue at the sensing area of ​​the chip;

[0069] Step 3. Full etching and bonding of wafers and bonding

[0070] see Figure 4 , take a bonded wafer, first perform full etching on the position above the subsequent electrode area of ​​the bonded wafer, and then bond the bonded wafer that has been fully etched on the first insulating layer through an adhesive, so that the A cavity is formed above the sensing...

Embodiment 2

[0084] A method for manufacturing a metal wafer-level etching type surface acoustic filter chip packaging structure, which includes the following process steps:

[0085] Step 1, see Figure 10 , take a surface acoustic filter chip wafer;

[0086] Step 2. Prepare the first insulating layer

[0087] see Figure 11 1. Apply a certain thickness of insulating glue on the surface acoustic filter chip wafer by glue coating process, such as PI (polyimide), PA (nylon, polyamide), and use photolithography and development to seal the electrode area and Removal of the insulating glue at the sensing area of ​​the chip;

[0088] Step 3: Half-etch and bond the wafers and bond them

[0089] see Figure 12 , take a bonded wafer, first half-etch the position above the subsequent electrode area of ​​the bonded wafer, and then bond the bonded wafer that has been half-etched to the first insulating layer through an adhesive, so that the A cavity is formed above the sensing area of ​​the chip...

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Abstract

The invention relates to a metal wafer level etching surface acoustic wave filter chip packaging structure manufacturing method, comprising the steps of: first, taking a surface acoustic wave filter chip wafer; second, preparing a first insulating layer; third, fully etching and bonding a bonded wafer; fourth, preparing a second insulating layer; fifth, electroplating a first metal layer; sixth, preparing a third insulating layer; seventh, reballing; and eighth, cutting. The method can provide a surface acoustic wave filter in a smaller size and of a smaller area, and reduce manufacturing costs.

Description

technical field [0001] The invention relates to a method for manufacturing a packaging structure of a metal wafer-level etching surface acoustic filter chip, and belongs to the technical field of semiconductor packaging. Background technique [0002] Surface acoustic filtering devices are widely used in RF and IF applications, including cellular phones, radiotelephones, and various radios. Through the use of surface acoustic filtering, these electronic devices are processed by filtering and delaying electrical signals. Due to the product performance and design functional requirements of the surface acoustic filter, it is necessary to ensure that the functional area of ​​the filter chip cannot touch any substance, that is, the cavity structure design. [0003] In the existing surface acoustic filter device packaging structure, the filter chip is connected to the ceramic substrate through conductive bump flip-chip welding and completely embedded in the cavity of the substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P11/00
CPCH01P11/007
Inventor 张江华
Owner JCET GROUP CO LTD
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