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Method for fabricating sensing device

A technology of sensing device and manufacturing method, applied in semiconductor/solid-state device manufacturing, instrument, character and pattern recognition, etc., capable of solving problems such as complicated manufacturing process of fingerprint sensing device 1

Inactive Publication Date: 2016-10-05
PRIMAX ELECTRONICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to protect the circuit board 11, another insulating layer or protective layer needs to be provided on the lower surface of the circuit board 11 during the manufacturing process, which makes the manufacturing process of the known fingerprint sensing device 1 too complicated, and requires an improved manufacturing method to reduce the manufacturing process. the complexity

Method used

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  • Method for fabricating sensing device
  • Method for fabricating sensing device
  • Method for fabricating sensing device

Examples

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Embodiment Construction

[0040] The invention provides a method for manufacturing a sensing device, such as figure 2 As shown, it includes an adhesive process S1, a packaging process S2 and a step S3 of attaching a protective layer to the sensing surface, which will be further described below.

[0041] First please refer to image 3 , which is a schematic diagram of the appearance of the circuit board of the sensing device of the present invention in a preferred embodiment. Such as image 3 As shown, in this example, the circuit board 20 used for the subsequent adhesive process S1, packaging process S2 and protective layer bonding step S3 is a rigid-flex board (Rigid-flexBoard). The circuit board 20 includes a first circuit board 201 , a second circuit board 202 and a flexible printed circuit board 203 (Flexible Printed Circuit Board, FPCB). Wherein the first circuit board 201 and the second circuit board 202 are printed circuit boards (PCB), and the two are electrically connected through the flex...

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PUM

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Abstract

A method for fabricating a sensing device includes the following steps. Firstly, an adhering process is performed to attach a sensing integrated circuit on a first circuit board, wherein the sensing integrated circuit has a sensing surface. Then, a packaging process is performed to encapsulate the first circuit board within a package shell so that at least a portion of a top surface of the first circuit board is covered by the package shell. The sensing surface of the sensing integrated circuit is exposed to a top surface of the package shell. Afterwards, a protective layer is attached on the sensing surface.

Description

technical field [0001] The invention relates to a manufacturing method of a sensing device, in particular to a manufacturing method of a fingerprint sensing device. Background technique [0002] It has become a trend to apply fingerprint sensing devices to portable electronic devices. The fingerprint sensing device integrates the sensing electrode layer into a chip. When the user's finger presses the surface of the chip, the sensing electrode layer responds to the user's finger The finger ridges and finger recesses produce different capacitances, and then the chip obtains the fingerprint image of the user's finger. [0003] Generally speaking, the structure of the known fingerprint sensing device 1 is as follows: figure 1 As shown, its manufacturing method is as follows. First, a circuit board 11 is provided, and then a sensing chip 12 is arranged on the upper surface of the circuit board 11, and then a protective layer 13 is formed to cover the sensing chip 12, so that th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/20H01L21/98
CPCG06V40/1329
Inventor 郑家驹屈志庄
Owner PRIMAX ELECTRONICS LTD